Huzhou Pulim Semiconductor: Lays a Solid Foundation for Wafer Manufacturing Precision with Precision Motion Technology

As semiconductor manufacturing continues to advance towards advanced processes, the precision and alignment accuracy of wafers as they flow through hundreds of devices directly determine the final yield and performance of chips. Founded in 2023, Huzhou Pulim Semiconductor Co., Ltd. is rooted in the West Lake Science and Technology Innovation Park in Changxing County, Huzhou, Zhejiang Province. It specializes in the research, development, and production of core components for semiconductor precision handling. Leveraging its deep accumulation in the field of precision motion control, it has created a full-chain product matrix covering wafer handling robots, wafer alignment stages, ceramic wafer forks, and precision motion stages, providing solid domestic support for the production line upgrades of domestic wafer fabs.

Wafer handling robot: the core of efficient transmission in a clean environment

As the "executors" of wafers moving between various processes in the production line, the performance of wafer handling robots directly impacts the overall production efficiency of the line. The series of wafer handling robots launched by Huzhou Prim Semiconductor adopts a lightweight and high-strength structural design, coupled with a multi-degree-of-freedom collaborative control algorithm. It can stably accommodate the handling needs of full-size wafers ranging from 6 to 12 inches, achieving a sub-micron level of repeatable positioning accuracy and a transmission efficiency improvement of over 30% compared to traditional equipment. In response to the special requirements of semiconductor cleanrooms, this series of robots has undergone special design in material selection and motion trajectory optimization, significantly reducing the generation of particulate matter during movement and fully meeting the usage standards for Class 1 cleanroom environments. Additionally, the equipment supports seamless integration with mainstream AMHS automatic material handling systems and can be connected to the MCS material control system of wafer fabs, enabling efficient collaboration with OHT cranes and Stocker storage systems. It can complete precise wafer handover in complex production lines with hundreds of devices, reducing the idle time of wafers between processes and steadily improving the production line's utilization rate.

Wafer alignment stage: nanometer-level alignment ensures overlay accuracy

In key processes such as lithography and etching, the wafer alignment stage serves as the core carrier for achieving precise overlay of multi-layer patterns. The wafer alignment stage developed by Huzhou Prime Semiconductor integrates a high-precision visual recognition module and a real-time position feedback system. It can quickly complete the entire process of pre-alignment, mask, and high-precision alignment of wafers, supports multiple alignment recognition modes such as bright field and dark field, and can adapt to the alignment mark detection requirements under different process nodes. Relying on the self-developed high-speed synchronous control algorithm, this alignment stage significantly shortens the alignment response time. Even in the face of the stringent overlay requirements of advanced processes at 3nm and below, it can stably achieve high-precision alignment, avoiding yield losses caused by alignment deviations. The equipment also supports adaptation to self-alignment process scenarios and can cooperate with the production line to fulfill the alignment requirements of special processes such as self-alignment dual patterning and self-aligned silicides, providing reliable hardware support for the implementation of advanced processes.

Ceramic spline: a key component for high-rigidity load-bearing

As the load-bearing component that comes into direct contact with the wafer, the performance of the ceramic fork is directly related to the safety and stability of the wafer during handling. Huzhou Pulim Semiconductor utilizes high-performance alumina ceramic material to craft ceramic forks, which exhibit high rigidity, low deformation, and high insulation properties. These forks maintain stable deformation even during long-term high-speed reciprocating motion, preventing wafer fragments and positional shifts caused by deformation of the load-bearing component. Compared to traditional metal fork arms, the surface of the ceramic fork undergoes a special ultra-smooth treatment, ensuring no particulate contamination when in contact with the wafer. Additionally, its low thermal expansion coefficient maintains dimensional stability across a wide temperature range, adapting to various temperature environments during wafer transfer. This significantly reduces the fragment rate during wafer handling, making the ceramic fork a core and critical component in ensuring wafer safety in wafer handling robots.

Precision motion stage design: underlying technical support for advanced manufacturing processes

The precision motion stage is the "moving heart" of all semiconductor core equipment. Huzhou Prim Semiconductor has integrated multiple core technologies such as air-bearing hydrostatic support, nanometer-level laser interferometry, and multi-axis synchronous control in the field of precision motion stage design, creating a series of precision motion stages that can achieve nanometer-level positioning accuracy under large-range motion. The peak vibration during motion is strictly controlled below 0.5G, fully meeting the extreme requirements of advanced manufacturing processes for motion smoothness. Relying on years of technical accumulation, the company's precision motion stage design team can complete customized development according to different application scenarios: motion stages for wafer inspection scenarios can achieve real-time position feedback under high-speed scanning, and motion stages for lithography scenarios can complete multi-axis ultra-high-precision synchronous motion. All design aspects strictly follow the relevant SEMI standards of the semiconductor industry, ensuring long-term stable operation of the equipment under complex working conditions in wafer fabs.

From core components to complete precision motion systems, Huzhou Pulim Semiconductor is continuously filling the technological gap in the domestic semiconductor precision transfer field through solid technological iteration. In the future, as the company's research and development production base in Changxing continues to expand its production capacity, its full range of products will further cover more domestic wafer manufacturing and advanced packaging scenarios, injecting continuous precision power into the localization process of semiconductor equipment.