From core components to the entire system, Huzhou Prim has unlocked a new solution for wafer alignment and transfer

In the entire process of advanced process chip manufacturing, precision motion control capability is the underlying core that determines equipment yield and operational stability. From the transfer and transportation of wafers between different workstations, to the nanometer-level alignment and positioning in the lithography process, to the high-precision attitude adjustment in the inspection process, the motion error in each link can be directly transmitted to the chip manufacturing results, ultimately affecting the performance and yield of the product. Huzhou Pulim Semiconductor Co., Ltd., rooted in the science and technology innovation industrial cluster of Changxing, Zhejiang, has built a precision motion technology system covering core components, key modules, and complete systems, focusing on the real needs of the semiconductor manufacturing scenario. This provides a solid implementation path for the precision upgrade of domestic semiconductor equipment.

Air float rotary shaft: Contactless design lays a solid foundation for precision

As the core actuator component of a precision motion stage, the performance of the air-bearing rotary shaft directly determines the operational upper limit of the entire motion system. Unlike traditional mechanical contact spindles, the air-bearing rotary shaft from Prim Semiconductor relies on non-contact gas lubrication technology, completely eliminating issues such as accuracy drift, particle contamination, and vibration transmission caused by mechanical friction. This product can control axial and radial runout within 250nm, achieving sub-arcsecond positioning accuracy. Depending on different application scenarios, it offers a high-speed version up to 6000rpm and a low-speed version suitable for high-precision inspection scenarios at 1500rpm, fully covering the needs of various processes such as wafer grinding and high-precision inspection. The non-contact operating characteristic not only avoids debris pollution caused by metal wear but also meets the stringent requirements of Class 1 cleanliness in semiconductor manufacturing, fundamentally eliminating the risk of particle scratching on wafers that traditional mechanical spindles cannot overcome.

Ceramic fork: lightweight material achieves high-speed and stable transfer

The wafer transfer process demands extremely high standards for lightweight, rigidity, and cleanliness of the end-effector. Prim Semiconductor's ceramic wafer fork is precisely a core component designed to address this pain point. The wafer fork, which is integrally molded using high-performance engineering ceramic materials, significantly reduces its own weight while ensuring structural rigidity. This effectively minimizes the motion inertia during high-speed start-stop processes, avoiding the issues of surface scratches and particle shedding that are often associated with metal materials. It is also capable of smoothly grasping and transferring large 300mm wafers across workstations. This lightweight design significantly enhances the operational tempo of the wafer transfer system, while reducing the risk of wafer breakage during movement. In high-frequency operation scenarios such as wafer transfer and loading/unloading, it maintains a stable operating state for extended periods, reducing the frequency of equipment maintenance.

Wafer alignment stage: Multi-dimensional collaboration for nanometer-level alignment

In core processes such as lithography and inspection, wafer alignment stages serve as crucial carriers for achieving precise interlayer alignment. Prim Semiconductor's wafer alignment stages leverage the high-precision characteristics of air-bearing motion platforms, coupled with high-resolution visual inspection modules, to perform high-speed measurement of grid distortion on wafers before exposure. The correction data is fed forward in real time to subsequent process equipment, enabling independent high-precision overlay correction for individual wafers and exposure areas. This system not only fulfills basic alignment functions but also reserves scalable hardware and software interfaces. It allows for the addition of measurement and correction modules according to the needs of different processes, is compatible with third-party industrial applications, and can adapt to the wafer alignment requirements of multiple generations, ranging from mature to advanced processes. This helps wafer fabs improve overlay accuracy while effectively increasing wafer processing throughput per unit time.

Precision motion stage: full-chain technology closed-loop adapts to diverse scenarios

By deeply integrating core components such as the air-bearing rotary shaft, ceramic transfer module, and wafer alignment unit, Prim Semiconductor's full range of precision motion stages achieve maximum suppression of error motion, achieving industry-leading levels in positioning performance, speed stability, and resolution feedback. The entire system isolates external vibration interference through an air-bearing structure, minimizing the impact of vibration caused by personnel movement and equipment operation on the Fab floor. At the same time, through a full-chain thermal stability design, it avoids position drift caused by small temperature fluctuations. From wafer inspection platforms to customized motion control solutions, Prim Semiconductor has relied on continuous technological iteration since its establishment in 2023 to develop comprehensive capabilities ranging from core component research to full system integration. Its products and technologies are injecting solid underlying momentum into the localization and upgrading of semiconductor equipment.