Deeply cultivating the precision motion control track: Huzhou Pulim Semiconductor lays a solid foundation for wafer manufacturing precision with four core components

In the industrial belt of the Yangtze River Delta where the semiconductor industry is developing collaboratively, Huzhou Pulim Semiconductor Co., Ltd. has gradually grown into an important force in the domestic semiconductor equipment supporting field, thanks to its continuous deepening of research in the field of nanoscale precision motion control. Based in the manufacturing base of Changxing, Huzhou, the company has built a complete product system covering core components to full system integration, focusing on three core scenarios in wafer manufacturing processes: handling, rotation, and alignment. This provides solid technical support for improving precision and independent supporting in the domestic semiconductor manufacturing process.

Air-bearing rotary shaft: achieving ultra-smooth rotation through non-contact lubrication

In the wafer grinding, thinning, and high-precision inspection processes, the runout of rotating components directly determines the processing uniformity of the wafer surface and the accuracy of inspection results. Huzhou Pulim has introduced an air-bearing rotating shaft that utilizes gas lubrication technology to form a uniform and stable support gas film in the shaft clearance, allowing rotating components to operate in a completely non-mechanical contact state. This fundamentally eliminates the wear, vibration, and heat generation issues caused by friction in traditional mechanical bearings. Currently, this series of products has formed two mainstream versions: 6000rpm and 1500rpm, which can be adapted to high-speed wafer grinding and high-precision inspection scenarios respectively. The radial runout is controlled within 250nm, and the precision stability during long-term continuous operation is excellent, meeting the rotational support needs of 12-inch and smaller wafers in multiple processes.

Precision motion stage: an execution carrier with nanometer-level positioning

As the core actuator unit for achieving micrometer and nanometer-level displacement adjustments in semiconductor equipment, the design of precision motion stages requires simultaneous consideration of three major indicators: travel range, positioning accuracy, and motion smoothness. Huzhou Prim's precision motion stage products deeply integrate air-bearing guide structures with high-precision linear drive solutions, relying on fluid mechanics simulation to optimize the distribution of air film, thereby minimizing creeping and vibration during motion. The platform can be extended with multi-axis linkage configurations according to customer needs, achieving submicron-level repeatable positioning within a large travel range in scenarios such as wafer transfer, probe testing, and optical inspection. At the same time, it possesses excellent dynamic response capabilities, effectively enhancing the overall operational efficiency of the equipment while ensuring accuracy.

Wafer alignment stage: Establishing a high-precision positional reference

Wafer alignment is a crucial step in the chip manufacturing process, spanning multiple processes such as lithography, bonding, and testing. The accuracy of alignment directly affects the effectiveness of chip interconnection and the final yield. Huzhou Prim's wafer alignment platform integrates a high-precision visual acquisition module and a multi-degree-of-freedom fine adjustment mechanism. It quickly acquires feature data of wafer edges and alignment marks through optical sensors, completes circle center fitting and angular deviation calculation using self-developed algorithms, and then drives the motion platform to perform micron-level position compensation. This solution achieves stable performance with pre-alignment accuracy within ±5μm. For customized versions tailored for advanced packaging and 3D integration scenarios, it can further accommodate infrared alignment mode and meet the alignment requirements of upper and lower layers in transparent silicon scenarios, providing a reliable positional reference for subsequent processes.

Ceramic wafer fork: a lightweight and highly reliable carrier for wafer transfer

The high-speed transfer of wafers between different processes imposes stringent requirements on the material properties of the end effectors. Huzhou Prim utilizes ceramic fork tips made of high-performance ceramic materials. Due to the inherent high rigidity, low deformation rate, and low particle precipitation characteristics of the material, these ceramic fork tips achieve lightweight design while possessing dimensional stability far exceeding that of traditional metal end effectors. During high-speed handling, the low inertia characteristics of the ceramic fork tips enable the robotic arm to achieve faster start-stop response, while avoiding the risk of scratching when contacting the wafer surface and significantly reducing the probability of debris during transmission. Currently, these ceramic fork tips are widely compatible with vacuum and atmospheric transmission scenarios for 6-12 inch full-size wafers.

From breakthroughs in materials and processes for core components to continuous refinement of motion control algorithms and system integration capabilities, Huzhou Prime Semiconductor is gradually opening up the full-chain R&D path of precision motion technology, providing highly adaptable customized solutions for domestic semiconductor equipment manufacturers, and continuously contributing technical value in niche areas in the process of supporting the localization of advanced processes.