From precision motion stages to wafer alignment stages: Huzhou Pulim lays a solid foundation for the localization of components and bases for semiconductor equipment

In the entire process of semiconductor manufacturing, precision motion control and wafer transfer positioning technology serve as the core underlying support that determines the yield and production efficiency of chip processes. Since its establishment, Huzhou Prim Semiconductor Co., Ltd. has consistently focused on deepening its research in this field. Relying on the multidisciplinary R&D accumulation of its core team, the company has achieved full independent research and development in key components such as precision motion stages, ceramic wafer forks, air-bearing rotary axes, and wafer alignment stages, providing solid component support for the localization process of domestic semiconductor equipment.

Nanoscale precision motion stage design: breaking through the accuracy bottleneck

Precision motion stages are the core carriers for achieving micron-level displacement control of wafers in semiconductor equipment. The R&D team at Huzhou Prim starts with the principle of air-bearing static pressure and nano-interference feedback system to break through the accuracy limit of traditional mechanical structures. The entire design adopts a modular rigid structure layout, optimized through multi-axis motion decoupling algorithms, to control the positioning accuracy of the platform within 30 nanometers, while significantly reducing the vibration amplitude during motion. Unlike general-purpose displacement stages on the market, it is specifically adapted for different semiconductor process scenarios such as lithography, metrology, coating, and development: the high-cleanliness version adopts a fully sealed dust-proof design, which can be directly connected to a Class 100 clean room for use; the heavy-duty platform optimizes the rigidity of the air film support, ensuring smooth trajectory under high-speed motion when carrying 12-inch wafers and supporting fixtures. Currently, this series of precision motion stages has achieved mass production of multiple models, and can provide customized solutions based on customers' equipment space, travel range, and accuracy specifications.

Ceramic wafer fork: a low-loss carrier for wafer transfer

In the automated wafer handling process, the material properties of the end effector directly determine the safety factor during wafer transmission. The ceramic wafer fork launched by Huzhou Prim is integrally molded using high-purity advanced ceramic materials, and undergoes ultra-precision grinding and clean polishing processes. The overall structure features low particle shedding, high rigidity, and temperature resistance. This design completely avoids the issues of traditional metal end forks, such as scratching wafers and generating micro-particle contamination. The ultra-thin fork structure can smoothly insert into the gaps between wafer cassettes, enabling high-speed and stable picking and placing in EFEM wafer transfer systems. Coupled with special passivation treatment on the surface, the ceramic wafer fork can work stably in strong corrosive environments such as etching and thin film deposition for extended periods, significantly extending its service life and reducing the frequency of spare parts replacement in the production line.

Air-bearing rotary shaft: a contactless high-precision rotating core

The air-bearing rotary shaft is a key component for achieving wafer rotation alignment and precise angular positioning. Huzhou Pulim's self-developed product relies on the principle of gas dynamic pressure lubrication to form a uniform gas film several microns thick between the spindle and the bearing, completely replacing the mechanical contact support of traditional ball bearings. This contact-free structure not only minimizes operational friction loss but also eliminates the risk of particle contamination caused by mechanical wear at its source, fully meeting the requirements for use in semiconductor cleanrooms. Currently, two mainstream versions, 6000rpm and 1500rpm, have been launched, with radial runout accuracy stably controlled within 250nm and temperature rise during long-term continuous operation maintained at an industry-leading level. The product requires no grease lubrication and can operate simply by connecting to clean compressed air that has been dried and filtered. The maintenance process is simple and convenient, making it widely applicable to various process steps such as wafer alignment, rotary cutting, and precision inspection.

Wafer alignment stage: Establishing a high-precision positioning reference

The wafer alignment stage is the core positioning unit in the front-end process of semiconductor manufacturing. Huzhou Prim has deeply integrated its self-developed air-bearing rotary shaft technology with precision motion stage technology, paired with a non-contact optical detection system and intelligent image processing algorithms, to achieve fully automated operation for wafer center positioning and angle correction. The equipment scans the wafer edge contour through optical sensors, accurately calculates the geometric center of the wafer using a geometric circle fitting algorithm, eliminating the initial position deviation caused by wafer handling robots; at the same time, it quickly identifies notches or flat edge features on the wafer edge, rotates the wafer orientation to a specified angle, and ensures high-precision overlay of multi-layer circuit patterns in subsequent lithography, etching, and other processes. The entire alignment process requires no manual intervention, with positioning speed and accuracy reaching advanced industry levels, laying a solid foundation for high-yield production in chip manufacturing.

From the material formulation and structural design of core components to the algorithm development of the entire motion control system, Huzhou Pulim has formed a complete independent technology closed loop. As the semiconductor industry's requirements for equipment precision and localization rate continue to increase, such precision component enterprises that specialize in niche markets will continue to provide core impetus for the independent and controllable output of the domestic semiconductor industry chain.