Four core components lay a solid foundation for wafer precision: Huzhou Prim's answer sheet for semiconductor precision manufacturing

In the entire process of semiconductor manufacturing, the micron-level precision control of wafers is the core lifeblood that determines chip yield. Supporting this goal are a series of key precision components hidden inside the equipment that determine overall performance. Huzhou Prim Semiconductor Co., Ltd. has deeply cultivated this field, focusing on the full range of wafer processing needs and creating a product matrix centered around wafer aligners, air-bearing rotary axes, ceramic wafer forks, and wafer alignment stages. This provides solid local support for the precision upgrade of domestic semiconductor equipment.

Serving as the "precision ruler" in the wafer processing stage, the wafer aligner plays a pivotal role in benchmark verification throughout the entire process. In multiple procedures such as lithography, etching, and thin film deposition, even a positional deviation of just a few microns in the wafer can lead to the misalignment and scrap of the entire chip circuit. Relying on proprietary optical recognition and algorithm compensation technology, Prim's wafer aligner can achieve millisecond-level precise capture of wafer edges and positioning gaps. It can continuously output stable benchmark parameters in complex workshop environments with vibration and temperature fluctuations, providing a reliable reference for position control in all subsequent processes, significantly reducing process losses caused by benchmark deviations.

The air-bearing rotary shaft serves as the "contactless heart" supporting the smooth movement of wafers and is also a highly challenging core motion component in high-end semiconductor equipment. Traditional mechanical contact-type rotary shafts, when rotating at high speeds, not only generate particulate contamination due to friction and wear but also tend to exhibit minor runout deviations, failing to meet the cleanliness and precision requirements for wafer processing. The air-bearing rotary shaft developed by Prim achieves completely contactless operation on a high-pressure air film through precise air path design, ensuring no friction, wear, or oil spillage during operation. With rotational precision reaching the submicron level, it maintains ultra-high motion stability over extended periods, perfectly adapting to the high-speed and smooth rotation needs of wafers in processes such as coating, development, and inspection. This fundamentally avoids process contamination caused by moving parts.

Ceramic wafer forks, as the "exclusive grippers" for wafer handling, directly determine the safety of wafer transfer between different workstations. Semiconductor wafers are extremely thin, and their surface photoresist and circuit structures are easily scratched. Mechanical wafer forks made of ordinary metal materials not only easily generate debris but may also damage the microcircuits on the wafers due to static electricity. Prim's ceramic wafer forks, crafted from high-purity alumina ceramic material, undergo high-precision grinding and surface polishing treatment, resulting in high overall hardness and strong wear resistance. Additionally, they possess excellent insulating and anti-static properties. The curvature of the fork tines and the support points have been optimized through thousands of wafer handling tests, enabling them to firmly hold the wafers for high-speed translation without causing any scratches on the wafer edges and surface, significantly reducing the debris rate during wafer transfer.

The wafer alignment stage serves as the "final execution platform" that integrates multiple precision technologies, representing the last precision checkpoint before wafers enter the core manufacturing process. Prim's wafer alignment stage deeply integrates high-precision linear motion modules, visual alignment systems, and proprietary control algorithms, enabling rapid angular correction and positional offset compensation of wafers, achieving micron-level precise alignment between wafers and tooling templates. This platform not only accommodates mainstream wafer sizes such as 8-inch and 12-inch wafers but also allows for customized adjustments according to customers' specific manufacturing process requirements, significantly reducing the alignment time for downstream semiconductor equipment manufacturers and enhancing the overall production efficiency of the entire line.

From core motion components to key modules for wafer processing, Huzhou Pulim Semiconductor has always focused on the underlying needs of precision manufacturing, integrating the pursuit of micron-level precision into the entire process of design, processing, and testing of every component. Amidst the general trend of domestic semiconductor equipment localization, such enterprises, which are deeply rooted in specialized fields and core technologies, are laying an indispensable foundation for the steady development of the domestic wafer manufacturing industry with their solid precision components.