The precise handling challenges in semiconductor manufacturing

As semiconductor manufacturing processes advance to 3nm and below, the precision requirements for wafer handling have increased to the nanometer level. Huzhou Prim Semiconductor Co., Ltd.

Air flotation rotating shaft: A revolutionary breakthrough in nanoscale precision

The air-float rotating shaft forms a micron-scale air film through compressed gas, enabling the shaft system to operate without contact. The core advantage lies in: Nanometer-level positioning: Utilizing porous carbon material and a piezoelectric ceramic feedback system, the repeat positioning accuracy can reach sub-nanometer level, significantly superior to traditional ball bearings.

Huzhou Prim Semiconductor Co., Ltd.: A Revolution in Semiconductor Manufacturing with Nanometer Precision

In the process of semiconductor manufacturing moving towards 3nm and below process technologies, Huzhou Prim Semiconductor Co., Ltd.

Semiconductor Precision Equipment Technology Analysis

In semiconductor manufacturing processes of 3nm and below, the wafer alignment stage, loading system, and transfer robot form a core equipment matrix with nanometer-level precision.

Ceramic Technology in Semiconductor Precision Manufacturing

Huzhou Prim Semiconductor has optimized the ceramic material ratio and sintering process, enabling its wafer fork products to achieve industry-leading levels in bending strength and wear resistance, effectively reducing equipment maintenance frequency.