Game Changers: The Rising Force of Domestic Semiconductor Precision Equipment

Amid the global semiconductor industry's accelerating evolution towards high-end and intelligent manufacturing, the autonomy and control of core equipment have become the key to determining the industry's lifeline. For a long time, the market for precision equipment in the semiconductor manufacturing sector has been monopolized by international giants, and domestic enterprises have faced dual challenges of technological blockades and supply chain security. Founded in 2023, Huzhou Prim Semiconductor Co., Ltd., with its core technology of nanometer-level ultra-precision motion control, has built a comprehensive precision solution covering the entire process of wafer processing within just three years, emerging as a pioneering force in the rise of domestic semiconductor equipment. 

As an innovation pioneer in the domestic semiconductor equipment field, Huzhou Prim Semiconductor has been shouldering the mission of breaking the foreign technological monopoly since its establishment. The company's core team originated from the Institute of Automation, Chinese Academy of Sciences. With profound technical accumulation and precise grasp of industry trends, it received capital favor at the very beginning. In 2023, it completed its angel round of financing, and in 2025, it once again received tens of millions of yuan in investment from funds such as Zhejiang Merchant Venture Capital and Meihua Angel. In 2025, the company's revenue exceeded 60 million yuan, with R&D investment accounting for over 20%, reaching 12 million yuan. Up to now, it has served over 30 customers and delivered hundreds of sets of equipment, with terminal customers covering domestic leading enterprises such as SMIC, Shanghai Silicon Industry, and Eswin Semiconductor. 

Core Technology Matrix: Building a Comprehensive Precision Solution for the Entire Wafer Processing Workflow 

Huzhou Prim Semiconductor, with nanometer-level ultra-precision motion control technology at its core, has developed a complete product system including precision motion stages, ceramic wafer forks, wafer alignment stages, and wafer transfer systems, providing a full-process precision solution for semiconductor manufacturing from raw material processing to finished product packaging. 

Precision motion stage: The core carrier for nanometer-level positioning 

Precision motion stages are core components of semiconductor manufacturing equipment, and their positioning accuracy directly affects the yield and performance of chips. Huzhou Primsemiconductor's independently developed nanometer-level ultra-high precision motion platform adopts air bearing hydrostatic technology and a nanometer interferometry feedback compensation system, achieving a positioning accuracy of 50 nanometers and a repeat positioning accuracy of 35 nanometers. The new generation of products has further improved the positioning accuracy to within 30 nanometers, reaching the international advanced level. 

This motion platform adopts aerodynamic principles to achieve non-contact movement. By adjusting the airflow to form an air film, the platform surface is suspended, reducing frictional resistance. This not only makes the movement smoother but also effectively reduces the heat and wear caused by contact friction, thereby extending the service life of the equipment. In the semiconductor manufacturing process, precision motion platforms are often used for the movement and positioning of wafers. Their high-precision motion control can ensure the accuracy of wafers during processing, thereby reducing material loss and increasing yield. Currently, this product has been widely applied in semiconductor lithography equipment, gene sequencers, and laser precision processing, among other fields. 

Ceramic Wafer Fork: The Safety Guardian for Wafer Handling 

In the precise field of semiconductor manufacturing, the wafer handling process is like the "nerve center" of chip production, connecting the entire process from raw material processing to finished product packaging. With 7nm and below advanced processes becoming the industry mainstream, the requirements for wafer handling in terms of accuracy, stability and cleanliness have reached nanometer-level strict standards. The ceramic wafer fork developed by Huzhou Prim Semiconductor is precisely the key component that meets these stringent requirements. 

The ceramic wafer fork is made of high-strength and high-hardness ceramic material, featuring light weight, good wear resistance and high chemical stability. It can safely and precisely transport wafers in ultra-clean environments. Compared with traditional metal wafer forks, the ceramic wafer fork does not cause metal ion contamination, effectively ensuring the cleanliness of wafers. Meanwhile, its excellent wear resistance can ensure the stability of precision during long-term use and reduce equipment maintenance costs. This product can be perfectly matched with the company's wafer handling robots and wafer transfer systems to achieve efficient and safe wafer transmission between various processes. 

Wafer alignment stage: Precise guarantee for micron-level alignment 

The wafer aligner is a key piece of equipment in semiconductor production. Its main function is to accurately align the wafer with the subsequent lithography or etching processes. The alignment accuracy directly affects the yield and performance of the chip. The wafer aligner from Huzhou Prim Semiconductor is equipped with a high-precision optical system and advanced motion control technology, enabling sub-micron alignment accuracy. 

This alignment station uses image processing technology to detect feature points on the wafer. Through a real-time feedback control system, it fine-tunes the position of the motion platform to ensure precise wafer alignment. Meanwhile, the equipment has excellent anti-vibration capabilities, maintaining stability during high-speed movement and positioning, effectively avoiding alignment deviations caused by external interference factors. Additionally, the company has applied artificial intelligence and machine learning technologies to the development of the wafer alignment station, creating intelligent products that not only significantly improve accuracy but also optimize operational convenience and user experience, enabling operators to manage and maintain the equipment more easily. 

Wafer transfer system: The intelligent bridge of automated production 

The wafer transfer system (EFEM) is hailed as the "intelligent gateway" of the semiconductor front-end process, serving as an automated bridge connecting wafer storage and process equipment. Its reliability and precision directly affect the yield and production efficiency of chips. The EFEM wafer transfer system of Huzhou Prim Semiconductor achieves efficient and precise wafer transmission in an ultra-clean environment, providing strong support for the automated operation of semiconductor production lines. 

This system integrates components such as wafer robots, loading ports, aligners, and control systems. It can automatically adjust the handling speed and path according to the production rhythm to ensure seamless connection at each stage. The system has three core capabilities: high-precision positioning, high-speed operation, and high-stability operation. It can automatically grasp, move, and place wafers between various production processes, with position deviation controlled at the micrometer level. Additionally, the system is equipped with real-time status monitoring functions. Through multiple sensors, it detects the operating status of each component, enabling immediate monitoring and early warning of equipment health, effectively reducing downtime losses caused by unexpected failures. Moreover, the system supports the SECS/GEM protocol, facilitating integration with the factory MES system to achieve data traceability throughout the production process. 

Future Outlook: Leading the New Journey of Semiconductor Precision Manufacturing 

With the continuous rise in global demand for electronic products, the semiconductor industry is under tremendous production pressure, but it also brings broad development opportunities for domestic semiconductor equipment enterprises. Huzhou Prim Semiconductor, with its profound technical accumulation and innovation capabilities in wafer processing, is expected to continue to lead in the future semiconductor technology wave. 

Facing the industry development trend, Huzhou Prim Semiconductor will continue to increase its investment in research and development, focusing on three major directions: equipment intelligence, micro-nano manufacturing technology, and environmental protection and sustainable development. In terms of intelligence, it will achieve comprehensive monitoring and optimization of the production process through the integration of artificial intelligence and Internet of Things technologies, thereby enhancing overall efficiency. In the field of micro-nano manufacturing technology, it will constantly break through technical bottlenecks to support the design of smaller and more complex chips. In the aspect of environmental protection and sustainable development, it will actively explore solutions to reduce resource waste and environmental impact, promoting the green development of the industry. 

Meanwhile, the company will further expand its market layout, strengthen cooperation with world-class manufacturers, introduce advanced technologies to China, and promote the overall progress of China's semiconductor industry. In the future, Huzhou Prim Semiconductor will continue to be driven by technological innovation and guided by customer needs, injecting more powerful momentum into the rise of domestic semiconductor equipment and helping China's semiconductor industry achieve the grand goal of self-reliance and control.