Deeply cultivating the precision semiconductor track: A comprehensive view of wafer core component technology at Huzhou Prim

In the entire process of semiconductor manufacturing, from wafer transportation and handling to nanometer-level alignment and calibration, the precision stability of each link directly determines the yield and process upper limit of chip production. Founded in 2023, Huzhou Pulim Semiconductor Co., Ltd. is rooted in the West Lake Science and Technology Innovation Park in Changxing, Huzhou, Zhejiang. Relying on a registered capital of 3.3 million yuan, it has established a complete business framework of "research and development + manufacturing + service". It focuses on the independent research and development of core components and system solutions for semiconductor precision motion, gradually forming a complete technology matrix covering core products such as ceramic fork, wafer handling robot, precision motion stage design, and wafer alignment stage. This provides solid support for the self-reliance and controllability of the domestic semiconductor equipment industry chain.

As the core executing component in the wafer handling scenario, the ceramic fork independently developed by Pulim Semiconductor is made of high-rigidity and low-expansion special ceramic material through integral molding. Its surface undergoes high-precision polishing treatment, ensuring lightweight structure while possessing excellent wear resistance and thermal stability. It can accommodate the picking and placing needs of full-size wafers ranging from 6 to 12 inches. During high-speed transmission, it prevents scratching and electrostatic damage to the wafer surface, significantly reducing the scrap rate of wafers during the transfer process. Currently, it is widely used in various complex working conditions such as wafer transmission and vacuum environment picking and placing.

Based on the core technology accumulation of ceramic wafer forks, the wafer handling robot developed by our company adopts a multi-degree-of-freedom collaborative control algorithm, paired with a lightweight carbon fiber structural arm. It achieves sub-micron-level repeatable positioning accuracy in a clean environment. The overall transmission efficiency is improved by more than 30% compared to conventional industry solutions. It can seamlessly interface with automation equipment for wafer storage, lithography, etching, and other upstream and downstream processes, helping the production line achieve unmanned continuous operation and significantly reducing the risk of quality fluctuations caused by human intervention.

In the field of precision motion stage design, Pulim Semiconductor has integrated air-bearing hydrostatic support, piezoelectric drive, and laser interferometric feedback technology, breaking through the precision bottleneck of traditional mechanical structures and achieving nanometer-level smooth motion control. This meets the ultra-high precision requirements of advanced manufacturing processes for motion platforms at 3nm and below. Its design scheme fully considers the complex working conditions of semiconductor production lines, maintaining stable motion accuracy even in environments with temperature fluctuations and slight vibrations, providing a reliable motion platform foundation for various high-end semiconductor equipment.

Relying on the technical base of the precision motion stage, the wafer alignment stage launched by the company integrates a high-precision visual recognition system and a multi-axis synchronous calibration algorithm, covering the entire alignment process including wafer pre-alignment, mask and wafer alignment, etc. Through sub-pixel image processing technology, the precise position of the alignment mark is extracted, and stable micron-level alignment accuracy can still be achieved under complex wafer surface reflection and thin film interference scenarios, effectively ensuring the overlay accuracy of lithography, bonding, probe testing, and other process steps, and helping the production line improve the yield performance of multi-layer stacking processes.

From core components to complete systems, Huzhou Pulim Semiconductor is gradually building a full-chain technological capability covering wafer transfer, motion control, and precise alignment. Relying on its manufacturing base in Changxing, it continues to deepen technological iteration, providing highly adaptable and reliable precision motion solutions for domestic semiconductor equipment manufacturers, and steadily advancing in the process of independent development of the semiconductor industry.