The semiconductor industry, as the cornerstone of modern information technology, directly affects technological autonomy and industrial upgrading. The precision equipment used in the wafer processing is the core support that determines the performance and yield of chips. In the core area of the Yangtze River Delta semiconductor industry belt, Huzhou Prim Semiconductor Co., Ltd. (hereinafter referred to as "Prim Semiconductor") focuses on independent innovation, delves into the field of ultra-precision motion control, and concentrates on four core products: precision motion stages, wafer aligners, wafer handling robots, and ceramic wafer forks, building a complete set of precision solutions for wafer processing. It has broken the foreign technological monopoly and injected strong momentum into the independent control of domestic semiconductor equipment. As an enterprise dedicated to the research and development and manufacturing of high-end semiconductor equipment, Prim Semiconductor has been committed to the "wafer processing equipment" technology high ground since its establishment. It has formed a cross-disciplinary R&D team covering mechanical design, precision control, and materials science, with an annual R&D investment ratio of over 18%. It continuously promotes the independent breakthrough and transformation of core technologies, forming a technical moat of "precision mechanics + intelligent control + special materials", and interprets the corporate philosophy of "Every movement is a commitment to precision; every lift is a responsibility to the industry" with professional strength.

Precision Motion Stage: The "Precise Positioning" Core of Wafer Processing

The precision motion stage is an indispensable core component in semiconductor wafer processing, undertaking the critical task of precise movement and positioning of wafers in different process steps. Its positioning accuracy and motion stability directly affect the processing results of subsequent processes such as lithography and etching. Prim Semiconductor has been deeply involved in the design of precision motion stages, integrating multi-disciplinary technologies to create a series of products that are both highly precise and reliable, meeting the processing requirements of wafers of different sizes. In terms of design concept, Prim Semiconductor's precision motion stages adopt a modular architecture, balancing flexibility and scalability. Through standardized interface design, they support customer customization as needed, reducing equipment complexity and maintenance costs. In terms of drive methods, a composite drive scheme of "linear motor + air bearing" is adopted. The linear motor provides gap-free high thrust density, ensuring transmission speed and response efficiency, while the air bearing forms a micron-level suspension layer through compressed air, eliminating mechanical contact friction and controlling transmission vibration within 0.1μm, fundamentally avoiding the impact of vibration on wafer processing accuracy. At the same time, the motion stage integrates a dual-redundant positioning module of "visual guidance + laser ranging", achieving a repeat positioning accuracy of less than ±10nm through laser interferometer calibration, precisely matching the processing requirements of 3nm and 2nm advanced processes. Additionally, by optimizing thermal management design and using low thermal expansion coefficient materials such as silicon carbide and aluminum nitride ceramics instead of traditional metals, the impact of temperature drift on positioning accuracy is reduced, ensuring stable performance during long-term continuous operation and providing a solid guarantee for the efficient advancement of wafer processing.

Wafer Aligner: The "Positioning Center" of Wafer Processing

Before entering the processing stage, wafers need to be precisely centered and angle-corrected; otherwise, even minor positional deviations can lead to the scrapping of an entire batch of chips. The wafer aligner is the "positioning brain" that undertakes this core task. Prim Semiconductor has broken through the limitations of traditional alignment technologies and developed a wafer aligner that is highly precise, highly adaptable, and highly stable, suitable for wafers ranging from 2 to 12 inches, including both common silicon-based wafers and third-generation semiconductor wafers such as silicon carbide and gallium nitride. In response to the detection limitations of traditional optical alignment technologies on transparent wafers and wafers with surface contamination, Prim Semiconductor has innovatively adopted a "non-contact multi-modal sensing + active compensation" technology, combined with a mechanical alignment solution. This not only achieves the non-contact measurement advantage of no damage but also avoids the shortcomings of optical detection, reliably handling various special wafers. By integrating infrared laser interferometers with white light confocal sensors, it is possible to simultaneously obtain multi-dimensional data such as the flatness, warpage, and edge profile of wafers, with a measurement resolution as high as 0.01nm. During the calibration process, the wafer calibrator holds the wafer in place and rotates it in situ through three position-adjustable detection support points. In combination with a piezoelectric ceramic-driven micro-motion platform, it can compensate in real time for the deformation of the wafer caused by temperature changes or mechanical stress, keeping the angle accuracy within ±0.1° and the center positioning accuracy within ±0.1mm. Additionally, the calibrator is equipped with a lifting unit that enables smooth transfer of the wafer through precise guide rails and bearing components, avoiding vibration and slippage during the calibration process. It is also linked with a precision motion stage to achieve fully automated and precise positioning of the wafer from storage to processing.

Wafer Handling Robot: The "Intelligent Bridge" for Wafer Transport

In the automated production lines of semiconductor manufacturing, the wafer handling robot is responsible for the efficient and precise transport of wafers between wafer carriers, calibrators, and processing equipment, serving as the "intelligent bridge" connecting various process steps. Prim Semiconductor has developed two major series of products, atmospheric robots and vacuum robots, to meet the full range of wafer transport needs in both atmospheric and vacuum core working environments of semiconductor manufacturing. The atmospheric robot is mainly responsible for extracting wafers from wafer carriers and placing them on pre-aligning equipment, operating in the equipment front-end module (EFEM). The design focus is on reducing particle generation and improving motion smoothness, with a repeat positioning accuracy at the micrometer level, meeting the requirements of atmospheric cleanliness. The vacuum robot, on the other hand, is responsible for wafer transport in vacuum environments and needs to address challenges such as lubrication, material outgassing, and thermal management. Through independent innovation, Prim Semiconductor has successfully developed a vacuum robot solution that meets international advanced standards, breaking the embargo on high-end vacuum robots from abroad. In terms of structural design, the robot adopts a symmetrical double-link frog-leg type design, with a compact structure that enables rapid and stable wafer transport in confined spaces, reducing vibration during movement and improving positioning accuracy. The joint parts use a ceramic-metal composite structure, ensuring lightweight while maintaining fatigue resistance. It is equipped with force feedback sensors and photoelectric sensing technology to monitor the clamping state and wafer size in real time, keeping the wafer breakage rate below 0.001% and significantly enhancing the reliability and safety of the handling process. At the same time, through modular design, it is compatible with wafers of different sizes and can quickly adapt to the needs of different process lines.

Ceramic Fork: The "Dust-Free Guardian" for Wafer Handling

As the core execution component of the wafer handling robot, the ceramic fork is the "key interface" that directly contacts the wafer, and its material properties and structural design directly determine the safety and cleanliness of wafer handling. Traditional metal fixtures are prone to metal ion contamination, while ordinary ceramic fixtures have the problem of being brittle and prone to fracture. Prim Semiconductor has made targeted breakthroughs and developed a ceramic fork that serves as a "protective fixture" for wafer handling. It has been verified by companies such as TSMC and SMIC and has been stably operating in 14nm and below advanced process lines for over 100,000 cycles without failure. In terms of material selection, Prim Semiconductor's ceramic fork uses high-purity alumina (Al₂O₃) + silicon carbide (SiC) composite ceramics as the base material, achieving densification through hot-pressing sintering. This not only retains the advantages of ceramic materials such as low friction, corrosion resistance, and strong chemical stability, ensuring that no contamination occurs in high-temperature or acidic/alkaline environments during processes like etching and cleaning, but also doubles the fracture toughness compared to ordinary ceramics, effectively solving the problem of brittleness and easy fracture of ordinary ceramic fixtures. In terms of structural design, the fork teeth of the ceramic fork adopt a "gradual arc design", precisely controlling the contact area with the wafer edge within 2mm² to avoid local stress concentration. Meanwhile, the surface of the fork teeth has undergone laser micro-etching treatment, creating micron-level grooves that can reduce contact friction by 40%, further minimizing particle generation. Additionally, through an optimized design that balances weight reduction and strength, the movement inertia is reduced, enhancing the handling efficiency. Complementing the air-bearing rotating shaft, it jointly improves the overall performance of wafer processing, making it an ideal component for advanced processes such as 3D NAND and advanced logic chips.

Collaborative Innovation Sets a New Benchmark for Domestic Semiconductor Equipment

The four core products of Prim Semiconductor are not isolated but form a complete wafer processing solution through collaborative design: the wafer aligner provides initial positioning data, the precision motion stage performs precise handling, the wafer handling robot undertakes the full process transfer tasks, and the ceramic wafer fork ensures a dust-free and damage-free handling process. The four products seamlessly integrate to achieve full-process automation and high-precision control of wafers from storage, calibration, transfer to processing. With independent breakthroughs in core technologies and high product reliability, Prim Semiconductor has become a new force in the domestic semiconductor equipment field. Its products are widely used in advanced packaging lines of leading domestic wafer fabs, with the single-batch wafer transfer yield increasing to 99.98%, reducing production costs and improving production efficiency for semiconductor manufacturing enterprises. At the same time, Prim Semiconductor has established a "full life cycle service system", from pre-delivery process matching tests to post-delivery remote diagnostics and rapid spare parts response, truly realizing a "device as a service" closed loop, earning the trust of global customers. Currently, semiconductor manufacturing is continuously advancing towards more advanced processes, placing higher demands on the precision and stability of precision equipment. In the future, Huzhou Prim Semiconductor Co., Ltd. will continue to focus on the field of ultra-precision motion control, continuously promoting the research and development of cutting-edge technologies such as "multi-physical field coupling simulation" and "AI adaptive control", constantly optimizing the performance of core products such as precision motion stages, wafer aligners, wafer handling robots, and ceramic wafer forks, driving the development of Chinese semiconductor equipment towards intelligence, modularization, and high-end, and contributing more to the global semiconductor industry upgrade and the rise of China's "chip" industry.