Nanometer Precision Foundation: Huzhou Prim's Autonomous Breakthrough in Semiconductor Precision Components

Nanometer Precision Foundation: Huzhou Prim's Autonomous Breakthrough in Semiconductor Precision Components 

As the global semiconductor industry continues advancing toward 3nm and 2nm cutting-edge processes, the precision requirements in chip manufacturing have risen to the nanometer level—billions of transistors must be integrated onto a chip no larger than a fingernail. Even a micrometer-level deviation at any stage could result in entire batches of expensive wafers being scrapped. On this critical path of precision manufacturing that defines the industry's future, Huzhou Prim Semiconductor Co., Ltd. is strengthening the foundational accuracy of domestic high-end chip equipment through independent innovation in core components. 

Located in the West Lake Science and Technology Innovation Park, Si'an Town, Changxing County, Huzhou City, Zhejiang Province, Huzhou Prim Semiconductor has been deeply committed to the field of ultra-precision motion control for semiconductors since its establishment. Starting with an initial registered capital of 3 million yuan, the company completed a capital increase to 3.3 million yuan in 2026 and secured Series A+ funding—reflecting strong investor confidence in its technological roadmap and industrialization capabilities. Centered on core nanometer-level motion control technology, the company has built a comprehensive product portfolio spanning ultra-precision components to key equipment. Its two subsidiaries, Hefei Prim Xinxin Technology and Hefei Prim Semiconductor, further extend the integration of R&D and manufacturing, establishing end-to-end capabilities covering technology development, component production, and system integration. 

In the entire semiconductor manufacturing process, the wafer loading system serves as the "first gate" connecting wafer storage with production equipment, directly determining the safety and precision baseline before wafers enter the processing stage. Traditional loading systems often suffer from positioning errors and wafer collisions during high-speed operation. Huzhou Primus, leveraging its self-developed multi-sensor data fusion technology, has created a highly efficient wafer loading system. Equipped with intelligent decision-making algorithms that dynamically optimize loading paths, this system enables rapid alignment of wafers of different sizes within ISO Class 1-3 ultra-clean environments. It can also detect in real time conditions such as wafer warping and misalignment, proactively avoiding handling risks. This ensures zero damage during wafer transfer from FOUP carriers to processing stations, improving loading efficiency by nearly 30% and establishing the first line of precision defense for subsequent processes like lithography and etching. 

As a core equipment for achieving sub-micron wafer alignment, the performance of the wafer aligner directly affects the overlay accuracy of chips. Huzhou Prim's wafer aligner integrates self-developed laser interferometry and multi-sensor fusion calibration technology, overcoming the limitations of traditional alignment systems that rely solely on visual recognition. It can simultaneously capture wafer notch features, surface deformation, and spatial orientation, and combined with dynamic compensation algorithms, achieves stable sub-micron alignment precision across 4-inch, 6-inch, and 8-inch wafers. This makes it fully compatible with high-precision manufacturing scenarios such as advanced packaging and MEMS fabrication, effectively keeping the pattern transfer error between wafers and masks within the minimal allowable range defined by process requirements. 

At the heart of enabling ultra-high precision operation for alignment stages and various inspection equipment lies Huzhou Prim's self-developed air-floating rotary axis. Unlike traditional mechanical bearings that rely on contact-based transmission, this air-floating rotary axis achieves completely non-contact levitation by forming a rigid, uniform air film between the shaft and its support surface, fundamentally eliminating issues such as friction loss, vibration disturbances, and operational heat generation. Combined with its proprietary real-time error compensation method for precision air-bearing motion platforms, the system employs deep learning models to continuously monitor parameters including temperature, air supply pressure, and load current, dynamically correcting trajectory deviations. As a result, it delivers nanometer-level rotational accuracy, maintaining performance stability even during prolonged continuous operation—fully meeting the most demanding requirements for rotational motion in semiconductor wafer inspection and precision grinding processes. 

The seemingly unremarkable ceramic wafer fork is actually a critical component—the "last centimeter"—that safeguards wafer safety during wafer handling. Precision-machined from high-purity engineering ceramics, the ceramic fork features extremely low surface roughness, excellent insulation properties, and high structural rigidity. During wafer handling, it prevents electrostatic damage to circuitry and avoids generating micro-particles through contact friction that could contaminate ultra-clean environments. Moreover, it maintains near-zero deformation even under high-speed transfer, perfectly meeting the high-frequency and high-cleaning requirements of EFEM wafer transfer systems. As such, it has become the core choice for replacing imported components in domestically produced precision handling equipment. 

From core flotation components at the foundational level to integrated wafer loading and alignment systems, Huzhou Prim is continuously advancing along the path of "nanometer precision," steadily progressing in the domestication of semiconductor precision equipment and providing a continuous underlying drive for independent and controllable domestic chip manufacturing.