Deeply rooted in the field of semiconductor precision motion, Huzhou Primus builds core support for the entire wafer fabrication process chain.

As semiconductor manufacturing continues to advance toward 3nm and beyond, the precision of wafer handling, positioning, and transport throughout the entire process directly determines final chip yield and production efficiency. Located in the Xihu Science and Technology Innovation Park, Si'an Town, Changxing County, Huzhou City, Zhejiang Province, Huzhou Prim Semiconductor Co., Ltd.—a technology-driven enterprise established in 2023—has focused since its inception on core technologies for precision motion control in semiconductors. The company has been intensively developing key equipment components such as wafer transfer systems, wafer loading systems, air-floating rotary axes, and wafer-handling robots, providing solid domestic momentum for the independent upgrading of China's semiconductor manufacturing supply chain. 

Centered on the wafer handling system, strengthening the foundational capabilities of process transfer 

The wafer handling system serves as the "vascular network" in semiconductor production lines, connecting processes such as lithography, etching, and thin-film deposition. Its performance directly affects the safety and efficiency of wafer transfer between different stages. Leveraging years of technological expertise, Huzhou Primus's wafer handling system has achieved multiple breakthroughs in key parameters: its multi-axis motion modules are made of lightweight, high-strength materials, enabling repeat positioning accuracy within ±0.1 mm, ensuring stable compatibility with mainstream 8-inch and 12-inch wafers. The built-in HEPA clean filtration unit maintains a continuous ISO Class 1 clean environment, effectively minimizing particle contamination risks at the source. 

To meet the higher demands of advanced processes on transmission efficiency, Prim has integrated intelligent path planning algorithms into the system control logic, enabling dynamic adjustment of wafer transfer routes based on real-time production line station status. This achieves a wafer processing capacity exceeding 300 wafers per hour. Additionally, through active damping vibration suppression technology, the vibration amplitude during transport is controlled at the nanometer level, completely eliminating micro-damage to wafers during high-speed movement. 

The wafer loading system works in coordination with the handling robot to achieve precise control throughout the entire loading and unloading process. 

If the wafer transfer system is the transmission artery of a production line, then the wafer loading system serves as the critical hub connecting wafer storage with processing equipment. Huzhou Prim's wafer loading system features a specially optimized end-effector design that can flexibly switch between vacuum suction and edge gripping modes depending on the wafer material and thickness. This ensures no damage to the photolithography patterns on the wafer surface while preventing chipping risks for thin and fragile wafers. Equipped with an integrated sensor combining vision positioning and laser ranging, the system achieves precise position calibration instantly upon wafer insertion, with positioning accuracy controlled at the micron level, completely eliminating the risk of equipment jamming caused by wafer misalignment. 

As the core actuator of the wafer loading system, Prim's self-developed wafer handling robot features a multi-degree-of-freedom serial structure design, with its motion range flexibly customizable according to different production line layouts. The joints of the robot integrate high-precision torque control modules, enabling adaptive force adjustment during wafer pickup and placement—ensuring smooth handling even for ultra-thin third-generation semiconductor SiC wafers. Deeply integrated with the wafer loading system, the entire robotic process—from wafer cassette identification, wafer extraction, position calibration, to delivery into processing stations—operates fully automatically without human intervention. This not only reduces labor costs but also eliminates contamination risks associated with manual operations. 

Breakthrough in air-floating rotary shaft technology fills the critical gap in ultra-precision manufacturing processes 

In processes such as wafer dicing, inspection, and grinding—where rotational precision is critical—the friction and wear issues associated with traditional mechanical contact-type spindles have long been a bottleneck limiting improvements in process accuracy. Huzhou Primus has deeply integrated air-bearing technology with semiconductor manufacturing requirements, introducing a series of air-floating rotary spindles. These utilize precisely filtered clean compressed air to form a uniform, rigid air film between the spindle and its support surface, enabling completely non-contact, suspended rotation. 

This air-floating rotary axis completely eliminates vibration and wear caused by mechanical friction, maintaining long-term rotational runout accuracy stably within 1 micron. It not only significantly extends component service life but also enables near-zero-maintenance operation. To meet diverse application requirements, Primus can customize the air-floating structure design—whether for compact production line workstations requiring low height and small footprint, or for wafer grinding applications demanding high load capacity and rigidity—ensuring a tailored solution that meets nanometer-level processing and inspection needs during wafer rotation. 

Since its establishment in 2023, Huzhou Prim Semiconductor Co., Ltd. has consistently focused on "technology implementation and application-specific adaptation" as its core development strategy. Leveraging continuous R&D investments in precision motion control, air-floating technology, and machine vision, the company has gradually built a comprehensive product portfolio covering wafer transfer, loading, and rotational positioning. Going forward, as China's semiconductor industry advances toward higher process nodes and greater production capacity, Prim will continue to iterate its core technologies, providing stronger component support for the independent and controllable manufacturing equipment in the semiconductor sector.