Huzhou Prim Semiconductor Co., Ltd.: A Revolution in Semiconductor Manufacturing with Nanometer Precision

In the process of semiconductor manufacturing moving towards 3nm and below process technologies, Huzhou Prim Semiconductor Co., Ltd.

Semiconductor Precision Equipment Technology Analysis

In semiconductor manufacturing processes of 3nm and below, the wafer alignment stage, loading system, and transfer robot form a core equipment matrix with nanometer-level precision.

Ceramic Technology in Semiconductor Precision Manufacturing

Huzhou Prim Semiconductor has optimized the ceramic material ratio and sintering process, enabling its wafer fork products to achieve industry-leading levels in bending strength and wear resistance, effectively reducing equipment maintenance frequency.

Precision equipment and technologies in semiconductor manufacturing: wafer aligners, ceramic wafer forks and handling systems

Wafer aligners are core equipment in modern semiconductor manufacturing to ensure processing accuracy. Their working principle is based on high-precision optical sensors and laser measurement technology.

Precision equipment and technological breakthroughs in semiconductor manufacturing

In the process of semiconductor manufacturing advancing towards 3nm and below, the precision of wafer processing equipment directly determines the yield and performance of chips.