In the microscopic world of semiconductor manufacturing, the control of nanometer-level precision is the core lifeline that determines the performance and yield of chips. Since its establishment in 2023, Huzhou Prim Semiconductor Co., Ltd. has been focusing on this core demand, concentrating on nanometer-level ultra-precision motion control technology. Taking core equipment such as wafer transfer systems, wafer handling robots, precision motion stages, and air-bearing rotary axes as the starting point, it has built a comprehensive precision solution covering the entire wafer processing process, injecting strong momentum into the rise of domestic semiconductor equipment. 

From the Laboratory to the Mass Production Line: Technological Breakthroughs of Core Products 

Wafer transfer system: Connecting the "nerve network" of wafer manufacturing 

The wafer transfer system is a key hub in the semiconductor manufacturing process, responsible for precisely transferring wafers between different process equipment and storage units. Its performance directly affects production efficiency and product yield. Huzhou Prim's EFEM wafer transfer system integrates self-developed control systems and intelligent peripheral accessories. It can be flexibly configured with functions such as wafer ID reading, crystal boat box RFID sensing, and wafer edge alignment correction according to customer needs, achieving customized and efficient wafer handling. 

This system has achieved dual breakthroughs in cleanliness control and anti-vibration design: it can operate stably in a Class 1-100 clean environment, effectively avoiding particle contamination. Moreover, by optimizing the mechanical structure and motion algorithm, it can control micro-vibration during the transmission process to the nanometer level, ensuring zero offset of the wafer pattern during the transfer. At the same time, the system supports SECS/GEM protocol and can be linked with the MES system to achieve intelligent scheduling of the production process, significantly enhancing the automation level of semiconductor manufacturing. 

Wafer Handling Robot: The "Fingertip Art" of Precise Control 

As the core execution unit of the wafer transfer system, Huzhou Prim's wafer handling robot has been specially designed for the harsh environment of semiconductor manufacturing. The robot adopts a multi-axis structure, and the end effector is made of alumina or silicon carbide ceramic materials, which have the characteristics of high temperature resistance, corrosion resistance, and high hardness. It can maintain high-precision operation under extreme conditions such as vacuum and high temperature. 

To meet the handling requirements of ultra-thin and large-sized wafers, the manipulator integrates visual sensors and AI algorithms, enabling contactless pick-and-place operations with micron-level precision. In response to the potential damage to fragile wafers caused by traditional vacuum adsorption methods, the company has also introduced Bernoulli technology, which uses high-speed airflow to create a pressure difference on the wafer surface, achieving suspended support handling. This effectively avoids mechanical stress and surface contamination risks, and is particularly suitable for the handling of special materials such as silicon wafers with a thickness of less than 100um and flexible OLED films. 

Precision motion stage and air-bearing rotary axis: The "core support" with nanometer accuracy 

If the wafer transfer system is the "neural network" of semiconductor manufacturing, then the precision motion stage and air bearing rotary shaft are the "bones and joints" that achieve nanometer-level accuracy. Huzhou Primus' nanometer-level ultra-precision motion platform, equipped with self-developed air bearing hydrostatic technology and nanometer interferometry feedback compensation system, has achieved a positioning accuracy of 50 nanometers and a repeat positioning accuracy of 35 nanometers. The new generation of products has further improved the positioning accuracy to within 30 nanometers, reaching the international advanced level. 

Among them, the air floatation rotating shaft adopts the dynamic pressure air bearing technology, discarding the traditional sliding friction mode of solid contact. It uses air as the working medium and, through ingenious structural design, automatically forms an extremely thin air film during high-speed rotation, achieving non-contact support for the moving parts. This technology not only completely eliminates the precision loss caused by friction and wear but also significantly enhances the service life and stability of the equipment, providing reliable precision assurance for core processes such as semiconductor lithography and etching. 

Future Outlook: Facilitating the Self-reliance and Control of Domestic Semiconductor Equipment 

With the in-depth adjustment of the global semiconductor industry landscape, the independent control of domestic equipment has become the core strategy for the development of the industry. Huzhou Primetech, relying on its technological accumulation in ultra-precision motion control, is gradually breaking the monopoly of international giants in the field of core semiconductor equipment. 

In the future, the company will continue to focus on the research and development and innovation of nanometer-level ultra-precision motion control technology, further enhancing the precision and stability of its products, and expanding the application scenarios of its products in fields such as semiconductors, precision optics, and biomedicine. At the same time, the company will strengthen cooperation with upstream and downstream enterprises in China's semiconductor industry chain, jointly promoting technological progress and industrial upgrading of domestic semiconductor equipment, and laying a solid foundation for the high-quality development of China's semiconductor industry.