As semiconductor manufacturing progresses towards 3nm and lower process technologies, the precision requirements for wafer handling and calibration have risen to the nanometer level. Huzhou PrimTech Semiconductor Co., Ltd. has built a complete nanometer-level technology matrix through its own R&D of core equipment such as precision motion platforms, ceramic fork arms, wafer alignment tables, and wafer loading systems, filling the gap in domestic high-end semiconductor equipment and driving global semiconductor manufacturing towards higher precision and efficiency. 

I . Core Technology Breakthrough: From Point Innovation to System Collaboration 

1. Precision motion platform: The "skeleton" for nanometer-level positioning 

Prim's precision motion platform employs a six-axis motion platform (X/Y/Z translation and rotational movement around axes), dynamically adjusting the path through an intelligent feedback system to avoid collisions with the internal structure of the equipment. The transmission speed can reach over 30 pieces per minute. Its air-floating rotating shaft technology utilizes air bearings for non-contact rotation, eliminating the friction and wear problems of traditional mechanical bearings, and achieving rotational accuracy at the sub-micron level. For instance, the wafer position calibration device uses a pressure sensor group in conjunction with the driving roller to quickly calibrate the wafer position, eliminating the need to open the chamber to take wafers, significantly enhancing production efficiency. 

2. Ceramic disc fork: The "arm" for high-precision transmission 

The ceramic disc fork, as the core component for wafer handling, its material selection and design directly affect the transmission efficiency and wafer safety. The ceramic disc fork of Prim uses alumina or silicon nitride ceramics, which have high purity, high density and low thermal expansion coefficient. It can avoid metal impurities contamination in equipment such as etching machines. Through the combination of vacuum suction and mechanical clamping technology, it realizes wafer non-contact grasping, avoiding edge damage. Its structural design takes into account both lightweight and rigidity, maintaining nanometer-level jitter during high-speed transmission. 

3. Wafer Alignment Station: The "Eyes" for Nanometer-Level Positioning 

The wafer alignment station is a key component in the photolithography process. It achieves precise alignment of the wafer and the photomask through the collaboration of optical sensors and mechanical structures. Prim's alignment station employs multi-degree-of-freedom adjustment technology, utilizing piezoelectric ceramics for nanometer-level positioning accuracy. It integrates laser interferometers and visual sensors to monitor the wafer position in real time and perform closed-loop control, ensuring that the alignment error is less than ±5nm. For instance, its patented wafer adaptive three-point edge clamping device designs a three-point clamping structure that is compatible with different-sized wafers and has little impact on the wafer shape, ensuring stability and reliability. 

4. Wafer Loading System: The "Nerve" of Automated Transfer 

The wafer loading system is responsible for the transfer of wafers between equipment, and its performance directly affects the production cycle and the wafer damage rate. Prim's loading system adopts the air-floating rotating shaft technology, achieving non-contact rotation through air bearings, eliminating the friction and wear problems of traditional mechanical bearings, with a rotational accuracy of sub-micron level. Through an intelligent feedback system to dynamically adjust the path, it avoids collisions with the internal structure of the equipment, and the transfer speed can reach more than 30 wafers per minute. For example, the wafer position calibration device uses the collaboration of a pressure sensor group and the driving roller to quickly calibrate the wafer position, without the need to open the chamber to take wafers, significantly improving production efficiency. 

II. Synergistic Effects of the Technology Matrix: From Single Point Breakthrough to System Innovation 

Prim has built a complete nanoscale technology matrix through its own independently developed core equipment such as the precision motion platform, ceramic disc fork, wafer alignment platform and wafer loading system, filling the gap in domestic high-end semiconductor equipment. The synergy effect of its technology matrix is manifested as follows: 

Precision coordination: The nanometer-level positioning accuracy of the precision motion platform and the wafer alignment platform ensures that the error of the wafer during the transfer and alignment process is minimized. 

Efficiency synergy: The high-speed transmission capability of the ceramic disc fork and the wafer loading system, combined with the dynamic path adjustment of the precision motion platform, achieves a significant improvement in the production cycle. 

Safety collaboration: The non-contact grasping technology of ceramic disc forks, combined with the intelligent feedback system of the wafer loading system, jointly ensures the safety of the wafer during the transfer process. 

III. Market Application and Future Prospects 

Prim's technical matrix has been widely applied in the semiconductor manufacturing industry, with typical clients including leading manufacturers such as Huawei. Its products have won repeated market tests and high recognition due to their outstanding performance, reliability and quality. In just one year of establishment, it has served over 30 clients and delivered hundreds of sets of equipment. In the future, Prim will leverage its complete supporting facilities and strong R&D capabilities to continuously enhance its R&D production capacity, continuously explore new market areas, and through high-quality and efficient product development and production, strive to provide customers worldwide with higher-quality products and services. (AI-generated)