In the semiconductor manufacturing industry, wafers serve as the foundation of chips, and their processing accuracy directly determines the performance of the chips. As the industry moves towards higher precision and intelligence, technological innovations in wafer handling and processing equipment have become the core driving force for industry progress. Huzhou Prim Semiconductor Co., Ltd. (hereinafter referred to as "Prim") is a pioneering innovator in the domestic semiconductor equipment field. By relying on its independently developed precision motion platform, air-floating rotating shaft, wafer loading system, wafer alignment table, and ceramic disc fork, it has constructed a complete nanoscale technology matrix, providing high-precision and high-efficiency solutions for the global semiconductor industry. 

I. Precision Motion Platform: The "motion core" with nanometer-level precision 

The precision motion platform is the core actuator of semiconductor equipment. Prim uses air-floating technology to achieve nanometer-level accuracy. Its innovative design includes air-floating bearing technology, which uses compressed air to form a uniform air film to eliminate mechanical friction, ensuring that the motion platform maintains zero contact wear during high-speed operation, with a precision of up to the nanometer level. The multi-axis linkage control integrates X/Y/Z translation and rotation axes, and realizes complex trajectory movement through precise algorithms, meeting the high-precision process requirements of lithography and etching. The dynamic compensation capability combines real-time feedback from sensors and AI algorithms to dynamically adjust motion parameters, responding to temperature fluctuations or vibration interference in the production environment, ensuring the stability of the wafer's posture during transmission. This technology has been applied in scenarios such as wafer inspection and lithography alignment, significantly improving the yield rate and reducing the risk of wafer scrapping due to positioning errors. 

II. Air-float rotating shaft: The "core engine" for high-precision rotation 

The air-floating rotating shaft is a key component of the precision motion platform, and its performance directly affects the accuracy of wafer processing. Prim's air-floating rotating shaft, through innovative design, has broken through the friction and vibration bottlenecks of traditional mechanical bearings. Its technical highlights include air-floating bearing technology, which uses compressed air to form a uniform air film to achieve zero-contact wear, with a precision of nanometer level. The multi-axis linkage control integrates X/Y/Z translation and rotation axes, and realizes complex trajectory movement through precise algorithms to meet the requirements of high-precision processes such as lithography and etching. The dynamic compensation capability combines sensor real-time feedback and AI algorithms to dynamically adjust the rotation parameters to cope with temperature fluctuations or vibration interference in the production environment. This technology enables Prim's equipment to perform outstandingly in high-end processes such as 3D NAND and advanced logic chips, and becomes the trusted "dust-free handling solution" for customers. 

III. Wafer Loading System: The "Dust-Free Guardian" of Automation and Safety 

The wafer loading system is the "first checkpoint" for wafer entering the processing stage. Its core lies in achieving rapid and undamaged wafer grasping and placement. Prim's loading system integrates intelligent recognition technology, using cameras and sensors to monitor the wafer status in real time, ensuring that each wafer is in the precise position. Its core advantage is high-precision positioning, employing precise servo control to achieve sub-micron-level motion accuracy, ensuring the wafer remains stable during transportation. Dynamic stability is achieved by optimizing the structural design to reduce the vibration interference of the equipment itself, providing a reliable foundation for subsequent processing. Scene adaptability can automatically adjust the transmission strategy according to different wafer sizes and materials, enhancing production flexibility. 

IV. Wafer Alignment Station: The "Positioning Expert" with Micrometer-level Precision 

The wafer alignment station is a crucial step in semiconductor manufacturing, directly influencing the accuracy of subsequent processes such as lithography and etching. Prim's wafer alignment station uses sensors to monitor the position of the wafer in real time, combined with precise adjustment mechanisms to achieve micrometer-level positioning, ensuring that the wafer maintains its posture throughout transmission and processing. Its innovative design includes adaptive edge detection, using optical or mechanical sensors to identify the wafer's edges and automatically adjusting the clamping force to avoid positioning deviations caused by differences in wafer thickness. The dynamic compensation algorithm uses a closed-loop control system to real-time correct motion errors and cope with temperature fluctuations or vibration disturbances in the production environment. The multi-angle calibration capability supports precise positioning of the wafer in complex postures such as rotation and tilt, meeting the requirements of advanced packaging processes. This technology has been applied in scenarios such as wafer inspection and lithography alignment, significantly improving the yield rate and reducing the risk of wafer scrapping due to positioning errors. 

V. Ceramic Disc Fork: The "Dust-Free Guardian" for Wafer Handling 

During the wafer handling process, the selection of materials for direct contact is of utmost importance. Prim's ceramic wafer forks are made of high-purity alumina or silicon nitride, featuring superior properties such as high wear resistance, chemical stability, and optimized structural design. The high wear resistance makes its hardness comparable to that of diamond, preventing scratches on the wafer surface and extending the lifespan of the equipment. Chemical stability ensures no contamination in high-temperature or acidic/alkaline environments, maintaining the purity of the wafer during processes like etching and cleaning. The optimized structural design achieves a balance between weight reduction and strength, reducing motion inertia and enhancing handling efficiency. The wide application of ceramic fork structures enables Prim's equipment to perform exceptionally well in high-end manufacturing processes such as 3D NAND and advanced logic chips, becoming a trusted "dust-free handling solution" for customers. 

VI. Huzhou Prim Semiconductor Co., Ltd.: Leading the Industry's Future with Innovation 

Huzhou Prim Semiconductor Co., Ltd. was established in 2023. Its headquarters is located in Huzhou, Zhejiang Province, and its R&D production base is set up in Huishan Economic Development Zone, Wuxi. The company has a core team composed of domestic doctoral and master's degree holders in optical information science and technology, as well as senior engineers. They have been deeply engaged in fields such as complex robot system control, ultra-precision manufacturing processing, and nanometer-level motion control for many years, possessing rich industry experience. The company is committed to designing ultra-high precision motion solutions, wafer transfer (EFEM), production of core precision components for equipment, integration of the entire machine's software and hardware systems, and the research and development of complete machine equipment. It provides ultra-precision motion control and integrated machine solutions for domestic and foreign semiconductor, IC manufacturing, new energy, and precision optical instrument industries. 

The technical R&D team of Prim accounts for as high as 60% of the company. It is equipped with advanced facilities such as imported high-precision CNC machines, three-level clean laboratories, and optical detection equipment, which have laid a solid foundation for product research and development, production, debugging, and quality control. The company has received angel round investments from funds like Zhejiang Venture Capital and Meihua Angel, and possesses multiple patented technologies and software copyrights, demonstrating its strength in technological innovation and intellectual property rights. Through continuous technological innovation and product optimization, Prim is gradually becoming a leading enterprise in the domestic semiconductor equipment sector, providing high-precision and high-efficiency solutions for the global semiconductor industry, and promoting the advancement of China's semiconductor industry towards higher precision and efficiency. 

As semiconductor manufacturing progresses towards 3nm and lower process technologies, the processing accuracy of wafers has been enhanced to the nanometer level, presenting unprecedented challenges to equipment performance. Huzhou Prim Semiconductor Co., Ltd., through its independently developed core equipment such as ceramic wafer forks, wafer alignment tables, precise motion tables, and wafer handling manipulators, has established a complete nanometer-level technology matrix. This not only fills the gap in domestic high-end semiconductor equipment but also drives global semiconductor manufacturing towards higher precision and efficiency. In the future, Prim will continue to be driven by technological innovation, providing better and more efficient solutions for the global semiconductor industry, and leading semiconductor manufacturing to new heights.