As semiconductor manufacturing processes advance to 3nm and below, the precision requirements for wafer handling have increased to the nanometer level. Huzhou Prim Semiconductor Co., Ltd. has built a complete nanometer-level technology matrix through its own-developed equipment such as wafer calibrators and air-floating rotating shafts. This article will systematically analyze the composition of its core technologies and their innovative value. 

I. Technical Architecture of Wafer Transfer System 

EFEM (Equipment Front-end Module) 

Integrating the mechanical hand, calibrator and loading system enables the automatic transfer of wafers from the tray to the processing station. 

The rotating shaft of the air flotation device is made of porous carbon material, with a repetitive positioning accuracy reaching the nanometer level. Its service life is 3 to 5 times longer than that of traditional bearings. 

Wafer calibrator 

Based on optical sensors and laser measurement technology, the wafer position calibration is achieved (with an error of ≤ ±0.1mm), ensuring the alignment accuracy of lithography. 

II. Ceramic Plate Fork: The Key Component for Zero-Pollution Transportation 

Material characteristics: Made of alumina or silicon nitride ceramics, it features high hardness, low thermal expansion coefficient (CTE < 1×10⁻⁶/K) and corrosion resistance. 

Process innovation: By optimizing the sintering process and surface polishing technology, the risk of wafer edge damage is significantly reduced, and it can adapt to the strong corrosive environment of the etching machine. 

III. Breakthrough in the Design of Precision Motion Platform 

Air flotation movement platform 

Using compressed gas to form a micrometer-scale gas film enables frictionless movement, which is suitable for high-frequency handling scenarios. 

Vacuum compatibility design, meeting the requirements of advanced manufacturing processes. 

Multi-axis collaborative control 

Combined with the piezoelectric ceramic feedback system, the movement trajectory is dynamically adjusted to ensure the stability of the transportation. 

IV. The Intelligent Evolution of Wafer Handling Manipulators 

Structural Innovation 

The Dayang Hongchuang patented design employs a dual-handling system (flat mechanical hand + multiple suction cup grippers), enabling it to handle multiple wafers simultaneously, resulting in a 40% increase in efficiency. 

Intelligent Control 

The machine learning model predicts the negative pressure value of the suction cup in real time, dynamically adjusts the handling parameters, and reduces the damage rate of the wafers. 

V. The Industrial Contribution of Huzhou Prim 

Technical Matrix: Includes calibrators, loading systems, air-floating platforms, etc., filling the gap in domestic high-end equipment. 

Application Case: The ceramic disc shaft and the air-floating shaft have been applied in major international wafer fabrication plants, facilitating the mass production of 3nm processes. 

Conclusion: Towards the Future of Atomic Precision 

With the integration of AI and new material technologies, the wafer handling system will further develop towards atomic-level precision and zero-defect goals. The innovative practices of enterprises like Prim are reshaping the global semiconductor manufacturing landscape.