In the process of semiconductor manufacturing moving towards 3nm and below process technologies, Huzhou Prim Semiconductor Co., Ltd. has built a complete technical matrix with nanometer-level precision through its independently developed core equipment such as wafer calibrators, air-floating rotating shafts, wafer loading systems, and wafer alignment tables. Its technological breakthrough not only fills the gap in domestic high-end semiconductor equipment, but also promotes the global semiconductor manufacturing to move towards higher precision and efficiency. 

Analysis of Core Technical Equipment 

1.Wafer calibrator: The perfect combination of optical sensing and nanoscale control 

As the "navigator" for modern semiconductor manufacturing, the wafer calibrator uses high-precision optical sensors and laser measurement technology to continuously detect the position deviation of the wafer (error ≤ ±0.1mm), and achieves automatic calibration through a fine-tuning mechanism. This technology is the core for ensuring the accuracy of key processes such as lithography and etching, and its optical system and motion control algorithm have reached international leading levels. 

2. Air-float rotating shaft: An innovative solution for zero-friction movement 

The air-float rotating shaft adopting the air-float technology achieves zero-contact rotation through air bearings, eliminating the friction loss and pollution risks of traditional mechanical bearings. Its nanometer-level motion control capability ensures ultra-high stability of the wafers during transmission and processing, and is particularly suitable for high-precision semiconductor manufacturing environments. 

3. Wafer Loading System: Efficient and Safe Co-design 

This system achieves the non-destructive transfer of wafers between processing chambers through vacuum suction and multi-axis coordinated movement. The core component, the ceramic fork, is made of alumina or silicon nitride materials, featuring high hardness and chemical stability. The precise surface polishing process can prevent damage to the wafer edges, and it can also withstand strong corrosive gas environments. 

4. Wafer Alignment Station: The Key Guarantee for Sub-micron Precision 

The alignment station uses optical sensing and nanoscale motion control to ensure the precise positioning of the wafer within the processing center. The technical challenge lies in how to promptly feed the optical detection results back to the motion system. Prim Semiconductor has achieved an industry-leading level of error of ≤ ±0.1mm through its self-developed algorithms and high-stiffness structural design. 

Technological Innovation and Industry Impact 

The technical advantages of Prim Semiconductor stem from its "software and hardware integration" R&D model: The core team is led by a PhD from the Chinese Academy of Sciences, possessing both the ability to develop algorithms and to manufacture precise hardware. They can achieve full autonomous control from material ratio (such as the sintering process of ceramic pieces) to the entire system (such as the EFEM equipment). This vertical integration capability enables it to respond quickly to customers' customized demands, while shortening the production cycle and improving project delivery efficiency. 

As semiconductor manufacturing processes continue to approach the physical limits, Prim Semiconductor's nanoscale equipment technology will become a key driver in breaking through the bottleneck of "Moore's Law". Its products such as wafer calibrators and air-bearing rotating shafts not only represent the highest level of domestic semiconductor equipment, but also have reshaped the technical benchmark of "Made in China" in the global industrial chain.