The air-float rotating shaft forms a micron-scale air film through compressed gas, enabling the shaft system to operate without contact. The core advantage lies in: 

Nanometer-level positioning: Utilizing porous carbon material and a piezoelectric ceramic feedback system, the repeat positioning accuracy can reach sub-nanometer level, significantly superior to traditional ball bearings. 

Friction-free design: Eliminates mechanical wear, extends service life by 3-5 times, suitable for high-frequency motion scenarios such as wafer stages in lithography machines. 

Environmental adaptability: The vacuum compatibility and low coefficient of thermal expansion (CTE < 1×10⁻⁶/K) make it an ideal choice for semiconductor manufacturing. 

Precision Motion Platform: The Core Hub for Wafer Processing 

Modern semiconductor manufacturing imposes three technical requirements on the moving platform: 

Dynamic stability: The aviation aluminum alloy frame and the design with a resonant frequency of > 1 kHz ensure that the wafer positioning error during high-speed handling is ≤ 0.1 μm. 

Thermal management: The integrated temperature control system compensates for thermal deformation and maintains the processing environment temperature within ±0.1℃ of fluctuation. 

Modular design: For example, Tian Kun Automation's OHS system, it enables the automated upgrade of wafer transportation in old factories. 

Collaborative Innovation of Wafer Handling Manipulator and Ceramic Chip Fork 

Intelligent control of the robotic arm: Utilizing air-bearing rails and linear motors for drive, with an acceleration of up to 2G, and an UPH (unit-hour production capacity) of over 7,000 pieces. 

Material innovation for ceramic spatulas: High-purity zirconia ceramics possess both anti-static and wear-resistant properties, and the uniformity of pressure distribution when contacting the wafer has been improved by 40%. 

The practical case of Huzhou Prim Semiconductor Co., Ltd. 

As a key component supplier for semiconductor equipment in China, Prim has achieved breakthroughs in the following areas: 

Domestication of air-bearing bearings: The self-developed porous carbon air-bearing bearings have a stiffness increase of 30% and a cost reduction of 50%. 

Wafer processing equipment integration: Its Load Port interface is compatible with the FOUP standard, and the contamination risk has been reduced to the ISO 1 level of cleanliness requirements.