The precision equipment coordination system in semiconductor manufacturing

In semiconductor manufacturing processes of 3nm and below, the wafer alignment stage, loading system, and transfer robot form a core equipment matrix with nanometer-level precision. The wafer alignment stage achieves wafer position calibration (error ≤ ±0.1mm) through optical sensing and nanometer-level motion control. Its key technologies include: 

Optical alignment system: Utilizing near-infrared light and a microscopic objective lens to identify the edge marks on the wafer, and detecting imaging deviations through a focal plane sensor. 

Dynamic compensation mechanism: Utilizing the wedge error compensation technology (WEC), spring pressure is applied during the bonding process to maintain the parallelism of the wafer. 

Adaptive clamping: Such as Primus' three-point edge clamping device, which reduces the risk of deformation by accommodating different wafer shapes through rotatable clamping wheels. 

Technological Innovation and Practice of Huzhou Prim

As a representative of domestic semiconductor equipment, Prim has achieved multiple breakthroughs in the field of precision motion control: 

Wafer aligner: Integrated with laser ranging and fine-tuning mechanism, it calculates the wafer position through the time difference of reflected light and automatically corrects the deviation, supporting key processes such as lithography and etching. 

The handling robotic arm: Combining a high-rigidity structure with intelligent algorithms, it achieves rapid grasping of hundreds of wafers per hour. The vacuum adsorption technology ensures damage-free transmission. 

Patent layout: Its adaptive three-point clamping device, characterized by a simple structure and strong compatibility, enhances the stability of the loading system. 

Technical Synergy and Industry Trends

Currently, semiconductor equipment is moving towards high integration: 

System integration: The calibrator and the handling robot work in tandem to control the wafer positioning error within the nanometer range, propelling the manufacturing process from the micron era into the nanometer era. 

The acceleration of domestic substitution: Against the backdrop of domestic production rates exceeding 50% in etching, cleaning and other processes, enterprises like Primetech have gradually broken overseas monopolies through breakthroughs in core technologies.