Ceramic Wafer Fork: The Precise Hand for Wafer Handling 

In semiconductor manufacturing, wafer handling requires sub-micron positioning accuracy and zero contamination operation. Ceramic wafer forks, as the core component for wafer transfer, are made of alumina or silicon nitride ceramics, featuring high hardness, low thermal expansion coefficient and excellent chemical stability. Their surfaces are precisely polished to prevent mechanical damage to the wafer edges during handling and to withstand the highly corrosive gas environment in etching machines. Huzhou Prim Semiconductor has optimized the ceramic material ratio and sintering process, enabling its wafer fork products to achieve industry-leading levels in bending strength and wear resistance, effectively reducing equipment maintenance frequency. 

Air-floatation rotating shaft: Revolutionary breakthrough in nanoscale motion 

Conventional mechanical bearings suffer from insufficient positioning accuracy due to frictional heat deformation. In contrast, air-bearing technology in air-floated rotating shafts achieves zero-contact suspension through a gas film, resolving the issues of vibration and wear in nanometer-scale movements. This technology is particularly suitable for scenarios requiring high-speed and high-precision motion, such as the worktables of lithography machines. The core rotating components often use silicon carbide ceramic bases to meet the strict requirements of the air-floated system for material stiffness and thermal stability. Prim Semiconductor has combined ceramic materials with air-floated technology to develop a rotating shaft module with ±50nm positioning accuracy and a high-speed rotation capability of 2000rpm, significantly enhancing the efficiency of wafer alignment. 

Wafer handling robot: An intelligent terminal integrating multiple technologies 

Modern wafer handling manipulators are technological integrations of ceramic forks and air-floatation rotating shafts. Through multi-axis linkage control systems, these manipulators can perform wafer grasping, rotation, and precise placement in vacuum or corrosive environments. Their joint parts adopt a ceramic-metal composite structure, which ensures both lightweight and fatigue resistance. Prim semiconductor's manipulator products, through modular design, are compatible with wafers of different sizes and are equipped with force feedback sensors, further reducing the breakage rate. 

The strategic value of ceramic materials in semiconductor manufacturing 

From electrostatic chucks to air-bearing platforms, ceramic materials have become a key support for the upgrade of semiconductor equipment. Their high-temperature resistance, corrosion resistance and electrical insulation properties directly determine the chip yield and process limits. With the popularization of advanced processes such as 3D packaging, the demand for complex and customized ceramic components will continue to grow. Prim Semiconductor, through non-standard customization services, promotes the extension of ceramic technology from single components to systematic solutions, helping domestic semiconductor equipment break through international technological barriers. (AI-generated)