Wafer aligner: The Key to Nanometer Precision 

Wafer aligners are core equipment in modern semiconductor manufacturing to ensure processing accuracy. Their working principle is based on high-precision optical sensors and laser measurement technology. By projecting a laser beam onto the wafer surface and measuring the time and angle of the laser reflection, the system can calculate the actual position of the wafer. Once any deviation is identified, the aligner will automatically adjust the wafer using a fine-tuning mechanism to ensure it is in the correct position within the processing center (error ≤ ±0.1mm). 

In terms of application, wafer aligners are widely used in critical equipment such as lithography machines and etching machines. Through high-precision calibration, they can significantly enhance the integration and performance of chips, reduce defect rates, and thereby improve overall production efficiency. Especially in advanced semiconductor manufacturing processes of 3nm and below, the accuracy of wafer aligners directly determines the yield and performance of chips. 

Ceramic plate fork: The "chosen worker" for precise handling 

The ceramic wafer fork (ceramic mechanical arm) is a key component in the semiconductor wafer handling system. It adopts a negative pressure wafer picking method, using the suction cup principle to adsorb the semiconductor wafer onto the quartz or ceramic fingers, and completes the handling through the extension, rotation and lifting actions of the mechanical arm. 

This specially designed interdigitated electrode features a periodically arranged metal structure processed on a ceramic substrate through electrochemical techniques, and it possesses excellent electrical conductivity and electrochemical properties. In semiconductor manufacturing, ceramic substrates need to meet two core requirements: "high speed" and "cleanliness". As most processes are carried out in vacuum, high-temperature, and corrosive gas environments, the high mechanical strength, corrosion resistance, high-temperature resistance, wear resistance, high hardness, and insulation of ceramic materials make them an ideal choice. 

Huzhou Primus Semiconductor Co., Ltd.: Innovator in Precision Manufacturing 

Huzhou Primus Semiconductor Co., Ltd. was established in 2023. The team members are mainly composed of domestic PhDs, masters, senior grinding engineers and senior experts in the fields of optical information science and technology and precision manufacturing. The company has received angel round investment from funds such as Zhejiang Business Venture Capital and Plum Angels. The headquarters is located in Huzhou, Zhejiang Province, and the R&D and production base is set up in Huishan Economic Development Zone, Wuxi. 

The company's main business includes: 

Design of Ultra-Precision Motion Schemes 

Wafer transfer (EFEM) system 

Production of precision core components for equipment 

Integration of the entire machine's software and hardware systems and research and development of customized entire machine equipment. 

In terms of technological advantages, the company has an independent factory covering nearly 10,000 square meters, including a 2,000-square-meter advanced clean laboratory and a 1,000-square-meter ultra-precision processing workshop. It is equipped with over 20 ultra-precision processing machines. The inspection department is furnished with advanced inspection equipment such as picometer-precision laser interferometers and nanometer laser surface interferometers. 

Wafer handling robot: The guarantee of efficient transmission 

The wafer transfer robot is the "porter" on the semiconductor production line. Its working principle mainly relies on mechanical arms and flexible automatic control algorithms. When the system receives a transfer instruction, the mechanical arm uses vacuum adsorption technology to grasp the wafer, precisely positions it, and then moves the wafer to the designated position along the preset path. 

According to different working environments, wafer handling robots can be classified into two categories: 

Vacuum manipulator: Operates in a vacuum environment of 10⁻⁵Pa, mainly used for wafer transfer in cluster tools. 

Atmospheric mechanical hand: Adapted to production environments with cleanliness levels of 10 or above, it achieves pollution-free handling through negative pressure wafer suction technology. 

In the semiconductor industry, wafer transfer robots are widely used in multiple process steps such as lithography, etching, and ion implantation. They can quickly pick up and place hundreds of wafers per hour, significantly enhancing production efficiency. 

Air floatation rotating shaft: A precise solution for contactless rotation 

The air-floatation rotating shaft (air-floatation bearing) is an important technology in the field of precision motion control. Its working principle is based on the gas dynamics principle. Between the main shaft and the bearing, a certain pressure and flow rate of compressed air is provided through the gas supply system, forming a thin layer of air film. This air film can generate sufficient support force to make the main shaft float above the bearing and rotate freely without mechanical contact. 

This technology has significant advantages: 

No contact, no wear, and long service life. 

The coefficient of friction is extremely low. 

It can achieve positioning accuracy at the micrometer level or even the nanometer level. 

In the field of semiconductor manufacturing, the non-contact feature of air-floatation rotating shafts ensures the purity and stability of products, and is widely used in key equipment such as precision processing machines and wafer processing systems. 

Conclusion

From wafer aligners to ceramic plate forks, from handling robots to air-bearing rotating shafts, these precision devices and technologies collectively form the foundation of modern semiconductor manufacturing. As chip manufacturing processes continue to advance towards 3nm and beyond, the precision and reliability requirements for these devices are also increasing. The technological innovations of domestic enterprises such as Huzhou Prim Semiconductor Co., Ltd. are driving the Chinese semiconductor equipment industry towards higher levels of development.