Wafer aligner: Precision Assurance in Semiconductor Manufacturing

The wafer aligner is a crucial piece of equipment in the semiconductor manufacturing process, used for high-precision positioning calibration of wafers. Its working principle is based on high-precision optical sensors and laser measurement technology. By projecting a laser beam onto the wafer surface and measuring the time and angle of the reflected laser, the actual position of the wafer can be calculated. Once any deviation is identified, the aligner automatically adjusts the wafer using a fine-tuning mechanism to ensure it is in the correct position within the processing center. 

In high-end semiconductor manufacturing, wafer aligners are widely used in equipment such as lithography machines and etching machines. Through high-precision calibration, the integration and performance of chips can be significantly improved, the defect rate can be reduced, and the overall production efficiency can be enhanced. With the continuous advancement of chip manufacturing technology, the design of wafer aligners is becoming increasingly complex, capable of meeting higher precision requirements and faster calibration speeds. 

Wafer alignment stage: A key device for precise alignment

The wafer alignment stage is a specialized equipment used for achieving precise alignment during wafer bonding or testing processes. Its working procedure typically involves the following steps: Firstly, the first wafer is placed face down on the chuck of the equipment and transferred into the alignment machine; then it is moved in the Z-axis direction until it is vacuum adsorbed and fixed by the top transfer fixture; next, the second wafer is loaded into the machine face up, facing the first wafer; finally, the alignment marks of the second wafer are located and alignment is completed by moving the platform along the X/Y axes or rotating it at the θ angle. 

Wafer alignment technology can be divided into two categories: real-time image alignment and alignment with pre-stored alignment marks. In semiconductor manufacturing, alignment stages are widely used in processes such as wafer bonding and probe testing to ensure precise alignment between different wafers or between wafers and equipment. This is crucial for the fabrication of multi-layer chips and the formation of complex circuit structures. 

Air-floatation rotating shaft: An innovative solution for contactless precision drive

The air-floatation rotating shaft is a contactless bearing technology that uses a gas film to support the rotating shaft. Its working principle is based on gas dynamics. Through the gas supply system, a certain pressure and flow of compressed air are provided between the main shaft and the bearing to form a thin gas film. This gas film can generate sufficient support force to make the main shaft float above the bearing and rotate freely without mechanical contact. 

This unique working principle enables the air bearing spindle to have extremely high precision, an extremely low coefficient of friction, and an exceptionally long service life. In the field of precision manufacturing and processing, the air bearing spindle has become a core drive component and is widely used in equipment that requires high-precision rotary motion, such as semiconductor manufacturing equipment and precision measuring instruments. 

Ceramic plate fork: Precision electrodes in biomedical detection

The ceramic plate fork is a periodically arranged metal electrode processed on substrates such as ceramics and glass through electrochemical techniques. It features excellent electrical conductivity and electrochemical properties, enabling precise transmission and measurement of electrical signals. In biomedical detection, the ceramic plate fork is often used to construct microelectrode arrays for precise stimulation of biological cells and acquisition of electrical signals. 

The main applications of ceramic plate forks include: 

Electrochemical detection: Construction of electrochemical detection platforms, such as microplate readers and glucose sensors.

Cell stimulation and imaging: Precise control of electrical signals on interdigitated electrodes to stimulate cells and monitor and image their physiological activities.

Microfluidic chips: Integration of microfluidic technology to achieve high-throughput detection, separation, and analysis of biological samples.

Biosensors: Such as immunosensors and DNA sensors, for real-time monitoring of biomarkers and disease diagnosis. 

Huzhou Prim Semiconductor Co., Ltd.: Innovator of Precision Semiconductor Equipment

Huzhou Prim Semiconductor Co., Ltd. was established in 2023, with its headquarters located in Huzhou, Zhejiang Province, and its R&D and production base set up in Huishan Economic Development Zone, Wuxi. The company's team is mainly composed of domestic PhDs, masters, senior grinding engineers, and experienced experts in the fields of optical information science and technology and precision manufacturing. They have been deeply involved in complex robot system control, ultra-precision manufacturing, nanometer-level motion control, image vision, semiconductors, and optical products for many years. 

The company's main business includes the research and development and production of semiconductor equipment such as wafer transfer systems, wafer aligners, and air-bearing rotary shafts. Its technical advantages are reflected in: 

With over 20 ultra-precision processing machines and a nano-grinding workshop, the inspection department is equipped with high-precision inspection devices such as picometer-precision laser interferometers, nano-laser surface interferometers, and nano-precision cylindrical instruments. We independently developed a nano-detection algorithm system to achieve rapid iteration of product precision. Primus Semiconductor's wafer calibrators use high-resolution optical sensors for real-time monitoring and data feedback, ensuring that every operation is precise and error-free. They are also equipped with a powerful software platform, allowing users to flexibly adjust calibration parameters according to different wafer sizes and materials. The company has received angel-round investment from funds such as Zhejiang Merchant Venture Capital and Meihua Angel, providing ultra-precision motion control and complete machine integration solutions for customers in the semiconductor, IC manufacturing, new energy, and precision optical instrument fields at home and abroad.