As semiconductor manufacturing progresses towards 3nm and lower process technologies, the precision requirements for wafer handling and calibration have risen to the nanometer level. Huzhou PrimTech Semiconductor Co., Ltd. has built a complete nanometer-level technology matrix through its independently developed core equipment such as wafer handling manipulators, wafer calibrators, wafer alignment tables, and ceramic fork devices. This has filled the gap in domestic high-end semiconductor equipment and has driven global semiconductor manufacturing towards higher precision and efficiency. 

Core technology breakthrough 

Wafer handling manipulator: A precision handling tool at the nanometer level 

Prim's wafer handling manipulator adopts an adaptive three-point edge clamping design. The clamping wheels move back and forth along the diameter direction to achieve stable clamping of the wafer edges. This structure is both compatible and reliable, having minimal impact on the wafer shape and significantly reducing the risk of mechanical damage during the handling process. Its core advantage lies in its nanometer-level positioning capability. Combined with porous carbon material and piezoelectric ceramic feedback system, the repeat positioning accuracy can reach sub-nanometer level, far exceeding that of traditional ball bearings. 

Wafer Calibrator: The Perfect Fusion of Optical Sensing and Motion Control 

The wafer calibrator achieves precise calibration of the wafer position through the synergy of an optical sensing system and nanoscale motion control technology. Its error range can be controlled within ±0.1mm. The key technologies include multi-axis linkage control algorithms and real-time feedback mechanisms, ensuring stable performance even during high-speed handling. The seamless cooperation between the calibrator and the handling manipulator forms the core part of wafer transmission in semiconductor manufacturing. 

Wafer alignment station: The cornerstone of high-precision positioning 

The wafer alignment station is the core component of the wafer loading system. Through the combination of a precise motion platform and an optical positioning system, it achieves alignment accuracy of the wafer and the photolithography machine mask plate down to the nanometer level. This equipment adopts the air-floating rotating shaft technology, which forms a micrometer-level air film by compressing gas to eliminate mechanical wear, extending the lifespan by 3-5 times. It also has vacuum compatibility and a low thermal expansion coefficient, making it suitable for high-frequency motion scenarios. 

Ceramic plate fork: A guarantee for zero pollution transportation 

During the wafer transfer process, the ceramic fork is a key component, made of alumina or silicon nitride ceramics, featuring high hardness, low thermal expansion coefficient, and excellent chemical stability. Its surface has undergone precise polishing treatment, which can prevent mechanical damage to the wafer edges during handling, and can also withstand the strong corrosive gas environment in the etching machine. Prim has optimized the material ratio and sintering process of the ceramic material to achieve industry-leading levels in bending strength and wear resistance for the fork products. 

Technology Application and Market Prospects 

Prim's technical matrix has been widely applied in fields such as semiconductors, precision optics, and biomedicine. Its typical customers include first-tier manufacturers like Huawei. Its products, such as ultra-precision air-floating motion platforms and EFEM wafer transfer systems, have won high market recognition due to their outstanding performance and reliability. For instance, in the field of semiconductor wafer handling robots, Prim's robotic arms have a precision of ±0.1mm, and their navigation stability and equipment reliability are at the industry-leading level. 

Future Outlook

With the continuous advancement of semiconductor technology, Prim will continue to focus on the field of nanoscale ultra-precise motion control. By building new factories, conducting product research and development, and purchasing new equipment, it will further expand its market share. Its technological breakthroughs not only promote the process of domestic semiconductor equipment autonomy, but also provide strong support for the global semiconductor manufacturing to move towards higher precision and efficiency.