Deepening into the Semiconductor Precision Sector: Prim's Breakthrough Journey in Wafer Alignment Platforms and Handling Robotic Arms

Huzhou Prim Semiconductor Co., Ltd., established in 2023, is located in the Xihu Science and Technology Innovation Park, Si'an Town, Changxing County, Huzhou City, Zhejiang Province. It is a high-tech enterprise dedicated to the research, development, and implementation of ultra-precision motion control technologies in the semiconductor field. Backed by a combined 10,000-square-meter R&D and production base in Wuxi and Huzhou, the company has built a 2,000-square-meter clean laboratory and a 1,000-square-meter ultra-precision machining workshop. Its core R&D team consists of professionals with technical backgrounds from the Chinese Academy of Sciences. Since its founding, the company has consistently pursued a strategic focus on "technology implementation and application adaptation," steadily advancing in the specialized segment of semiconductor equipment. 

In the entire semiconductor manufacturing process, high-precision wafer handling is a fundamental step that ensures production efficiency and yield. The wafer transfer robot independently developed by Prim Semiconductor is a key device specifically designed to meet this critical need. This robot is compatible with various semiconductor processing stages and features a design combining vacuum suction with floating control. It supports customized non-standard fixtures for wafers of different sizes, offering strong operational stability and minimal positioning errors. By avoiding surface scratches and damage caused by traditional rigid-contact handling methods, it enables continuous and stable operation in high-cleanliness environments, perfectly meeting the demand for efficient wafer transfer between different process stations. 

As a core supporting equipment in the semiconductor lithography process, Prim Semiconductor's wafer alignment stage handles nanometer-level precision alignment tasks. Equipped with the company's self-developed air-floating rotary axis technology, this stage completely eliminates vibration and wear caused by mechanical friction. Under long-term operation, its rotational runout accuracy remains stably controlled within 1 micrometer, significantly extending the service life of key components and enabling nearly maintenance-free, reliable operation over extended periods. To meet diverse requirements across different production scenarios, the company offers customizable air-floating structural designs: lightweight, low-height solutions with minimal footprint for compact production workstations, as well as high-rigidity configurations suitable for high-load applications such as wafer grinding. These capabilities comprehensively satisfy nanometer-level processing and inspection demands during wafer rotation, laying a solid foundation for high-precision overlay performance in subsequent lithography steps. 

The application of high-performance ceramic fork components in the core vulnerable parts of alignment stages and robotic arms is crucial for ensuring long-term stable operation of the equipment. These structural components, fabricated from high-performance ceramic materials such as alumina, exhibit exceptional hardness, excellent electrical insulation, and a very low coefficient of thermal expansion. During wafer handling and alignment processes, they prevent electrostatic damage caused by direct contact between metal parts and wafers, while maintaining dimensional stability across a wide temperature range. This significantly enhances the overall precision retention and service life of the entire system at a fundamental level. 

Since its establishment, Huzhou Prim Semiconductor has consistently focused on three core areas—ultra-precision motion control, air-floating technology, and machine vision—investing heavily in research and development. The company has built a comprehensive portfolio of independent products centered around key process stages such as wafer handling and alignment. Going forward, it will continue to increase investment in technological R&D, continuously improving product accuracy and performance, and deepening collaboration with partners across the semiconductor industry chain, contributing further to the localization and upgrading of domestic semiconductor equipment.