Huzhou Prim Semiconductor: Precision Motion Platform Design Leads the Innovation of Wafer Handling Technology
As semiconductor manufacturing progresses towards 3nm and lower process technologies, the precision requirements for wafer handling and calibration have risen to the nanometer level. Huzhou PrimTech Semiconductor Co., Ltd. has built a complete nanometer-level technology matrix through its own R&D of core equipment such as air-floating rotating shafts, ceramic fork arms, wafer handling manipulators, and precise motion tables. This not only fills the gap in domestic high-end semiconductor equipment but also drives global semiconductor manufacturing towards higher precision and efficiency.
Air flotation rotating shaft: The core driving force with nanometer-level precision
The air-floating rotating shaft is the core component of the precision motion platform. It achieves zero-contact rotation between the shaft center and the bearing seat by utilizing a thin layer of gas film formed by compressed gas, completely eliminating the friction losses of traditional machinery. This technology originates from Bernoulli's principle. Through high-speed airflow forming a low-pressure air cushion in a specific air passage, the rotating shaft can operate stably at a nanometer-level accuracy. Prim Semiconductor optimizes the distribution of air holes and the rigidity design of the gas film to enable the air-floating rotating shaft to achieve sub-micron positioning accuracy in wafer processing, significantly improving the chip yield. For example, in the wafer epitaxy process, this technology can avoid the clogging of the rotating mechanism by high-temperature deposits, ensuring the continuous and stable operation of the wafer at temperatures ranging from 1550°C to 1750°C.
Ceramic spatula: A durable and corrosion-resistant tool for handling hot substances
The ceramic spatula is made of high-purity alumina or silicon carbide, featuring outstanding high-temperature resistance, chemical stability and mechanical strength. In the wafer handling machinery, the ceramic spatula achieves frictionless movement through an air-floating module. Its surface is polished, with a roughness lower than 0.1 micrometers, which can prevent scratches on the wafer surface. The innovative design of Prim Semiconductor includes porous carbon-based gas films, which further enhance the durability and adaptability of the gas films, ensuring the long-term reliability of the ceramic spatula in harsh processes such as etching and deposition. For example, in plasma etching processes, the ceramic spatula can effectively reduce residual reaction gases and lower the defect rate of the wafer.
Wafer handling manipulator: The integration of intelligence and efficiency
The wafer handling manipulator is the "bridge" that connects various process modules in semiconductor manufacturing. The mechanical hand of Prim Semiconductor combines air-floating linear guides with ceramic fork structures to achieve high-speed and high-precision transmission of wafers in a vacuum environment. Its core advantages include:
Non-contact handling: The wafer is suspended and moved on an air cushion through the air-floating module, avoiding physical contact contamination.
Intelligent Control: Integrating sensors and algorithms, it adjusts the transportation path in real time to cope with wafer warping or deviation.
Multi-environment compatibility: Seamless switching between the atmospheric transfer chamber, vacuum transition chamber and reaction chamber, capable of meeting the requirements of various processes such as etching and deposition.
Precision motion platform design: Collaborative innovation from components to systems
The precision motion platform is the "brain" of wafer processing equipment. Its design integrates air-floating rotating shafts, ceramic fork arms, and mechanical hand technologies to form a closed-loop control system. The motion platform of Prim Semiconductor has the following features:
Modular architecture: Supports independent control of the XYZ axes, and enables multi-angle adjustment through the universal joint base, meeting complex process requirements.
Dynamic stability: The high gas film rigidity design ensures that the nanometer-level positioning accuracy is maintained even at high-speed movement, reducing wafer vibration errors.
Customization capability: The air flotation parameters, stroke range and load capacity can be adjusted according to customer requirements. It is widely applied in processes such as lithography and inspection.
The technological breakthroughs and industry impact of Prim Semiconductor
As a leading enterprise in the domestic semiconductor equipment sector, Prim Semiconductor has broken the foreign technological monopoly through independent research and development. Its core team comes from the Chinese Academy of Sciences and possesses both software algorithm and precise hardware development capabilities. From air-bearing bearings to the entire system, they can achieve domestic production. For instance, in the production of 5nm process chips, Prim's motion platform equipment has shortened the wafer processing cycle by 20% and reduced the defect rate to below 0.01%. This achievement not only enhances the domestic autonomy and controllability of the semiconductor industry, but also provides a "Chinese solution" for global high-end manufacturing.
Future Outlook: Moving towards greater precision and intelligence
As semiconductor manufacturing technology progresses towards 2nm and below nodes, Prim Semiconductor is exploring the deep integration of the air flotation technology with AI and the Internet of Things. For instance, by continuously monitoring the changes in air film pressure and temperature, it predicts equipment maintenance needs, thereby further reducing downtime. At the same time, the company is continuously optimizing ceramic materials and air flotation structures, aiming to achieve an atomic-level (0.1 nanometer) positioning accuracy by 2026, laying the foundation for the next-generation chip manufacturing.
Conclusion
From the air flotation rotating shaft to the precision motion platform, Prim Semiconductor, based on technological innovation, has facilitated the leap from "lagging behind" to "keeping pace" in China's semiconductor equipment sector. Its products not only serve domestic wafer factories but are also exported to markets in Europe, America, Japan, and South Korea, becoming an indispensable part of the global semiconductor industry chain. In the future, with the deep integration of intelligent manufacturing and green manufacturing, Prim Semiconductor will continue to lead the forefront of precision motion technology, injecting new impetus into the world's chip industry.

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